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E2UMA16-26.5625M TR PDF预览

E2UMA16-26.5625M TR

更新时间: 2024-11-15 14:26:07
品牌 Logo 应用领域
日蚀 - ECLIPTEK /
页数 文件大小 规格书
3页 68K
描述
CRYSTALS 15/20 -40+85 16PF 26.5625MHZ ATCUT FUND HC-49/US

E2UMA16-26.5625M TR 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:ActiveReach Compliance Code:unknown
风险等级:5.7Is Samacsys:N
Base Number Matches:1

E2UMA16-26.5625M TR 数据手册

 浏览型号E2UMA16-26.5625M TR的Datasheet PDF文件第2页浏览型号E2UMA16-26.5625M TR的Datasheet PDF文件第3页 
RoHS  
Pb  
E2UMA16-26.5625M  
E2U M A 16 -26.5625M  
Series  
Nominal Frequency  
RoHS Compliant (Pb-free) Resistance Welded  
HC-49/US Crystal  
26.5625MHz  
Load Capacitance  
16pF Parallel Resonant  
Frequency Tolerance/Stability  
±15ppm at 25°C, ±20ppm over -40°C to +85°C  
Mode of Operation  
AT-Cut Fundamental  
ELECTRICAL SPECIFICATIONS  
Nominal Frequency  
Frequency Tolerance/Stability  
Aging at 25°C  
26.5625MHz  
±15ppm at 25°C, ±20ppm over -40°C to +85°C  
±5ppm/year Maximum  
16pF Parallel Resonant  
7pF Maximum  
Load Capacitance  
Shunt Capacitance (C0)  
Equivalent Series Resistance  
Mode of Operation  
40 Ohms Maximum  
AT-Cut Fundamental  
Drive Level  
1mWatt Maximum  
Storage Temperature Range  
Insulation Resistance  
-40°C to +125°C  
500 Megaohms Minimum at 100Vdc  
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS  
Fine Leak Test  
MIL-STD-883, Method 1014 Condition A  
MIL-STD-883, Method 1014 Condition C  
MIL-STD-883, Method 2004  
Gross Leak Test  
Lead Integrity  
Lead Termination  
Mechanical Shock  
Resistance to Soldering Heat  
Resistance to Solvents  
Solderability  
Sn 2µm - 6µm  
MIL-STD-202, Method 213 Condition C  
MIL-STD-202, Method 210  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
Temperature Cycling  
Vibration  
MIL-STD-883, Method 1010  
MIL-STD-883, Method 2007 Condition A  
MECHANICAL DIMENSIONS (all dimensions in millimeters)  
LINE MARKING  
1
E26.562M  
E=Ecliptek Designator  
M=MHz  
6.35  
MIN  
DIA 0.457  
±0.051(X2)  
11.18  
MAX  
4.88 ±0.20  
4.70  
3.68 MAX  
MAX  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev E 2/17/2010 | Page 1 of 3  

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