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E2SGA27-21.504M TR PDF预览

E2SGA27-21.504M TR

更新时间: 2024-11-26 21:18:31
品牌 Logo 应用领域
日蚀 - ECLIPTEK /
页数 文件大小 规格书
4页 138K
描述
CRYSTALS 15/30 0+70 27PF 21.504MHZ ATCUT FUND HC-49/UP

E2SGA27-21.504M TR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ActiveReach Compliance Code:unknown
风险等级:5.66Base Number Matches:1

E2SGA27-21.504M TR 数据手册

 浏览型号E2SGA27-21.504M TR的Datasheet PDF文件第2页浏览型号E2SGA27-21.504M TR的Datasheet PDF文件第3页浏览型号E2SGA27-21.504M TR的Datasheet PDF文件第4页 
RoHS  
Pb  
E2SGA27-21.504M  
E2S G A 27 -21.504M  
Series  
Nominal Frequency  
RoHS Compliant (Pb-free) Resistance Welded  
HC-49/UP SMD Crystal  
21.504MHz  
Load Capacitance  
27pF Parallel Resonant  
Frequency Tolerance/Stability  
±15ppm at 25°C, ±30ppm over 0°C to +70°C  
Mode of Operation  
AT-Cut Fundamental  
ELECTRICAL SPECIFICATIONS  
Nominal Frequency  
Frequency Tolerance/Stability  
Aging at 25°C  
21.504MHz  
±15ppm at 25°C, ±30ppm over 0°C to +70°C  
±5ppm/year Maximum  
27pF Parallel Resonant  
7pF Maximum  
Load Capacitance  
Shunt Capacitance (C0)  
Equivalent Series Resistance  
Mode of Operation  
50 Ohms Maximum  
AT-Cut Fundamental  
Drive Level  
1mWatt Maximum  
Storage Temperature Range  
Insulation Resistance  
-40°C to +125°C  
500 Megaohms Minimum at 100Vdc  
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS  
Fine Leak Test  
MIL-STD-883, Method 1014 Condition A  
MIL-STD-883, Method 1014 Condition C  
Sn 2µm - 6µm  
Gross Leak Test  
Lead Termination  
Mechanical Shock  
Resistance to Soldering Heat  
Resistance to Solvents  
Solderability  
MIL-STD-202, Method 213 Condition C  
MIL-STD-202, Method 210  
MIL-STD-202, Method 215  
MIL-STD-883, Method 2003  
Temperature Cycling  
Vibration  
MIL-STD-883, Method 1010  
MIL-STD-883, Method 2007 Condition A  
MECHANICAL DIMENSIONS (all dimensions in millimeters)  
LINE MARKING  
1
E21.504M  
E=Ecliptek Designator  
M=MHz  
4.50  
MAX  
13.30 MAX  
4.85  
MAX  
0.50 MIN (x2)  
4.88 ±0.20  
0.80 ±0.30 (x2)  
11.60 MAX  
NOTE: Coplanarity 0.360 MAX  
www.ecliptek.com | Specification Subject to Change Without Notice | Rev F 2/16/2010 | Page 1 of 4  

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