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DX30AM-68P

更新时间： 2024-02-05 02:06:19

品牌	Logo	应用领域
广濑 - HRS		连接器电信连接器和数据通信连接器
页数	文件大小	规格书
18页	1244K
描述
HIGH-DENSITY I/O CONNECTOR

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中文翻译

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技术参数
数据手册

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DX30AM-68P 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	ROHS COMPLIANT
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8536.69.40.30	风险等级：	2.27
Is Samacsys：	N	Base Number Matches：	1

DX30AM-68P 数据手册

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

DXM (1.27MM PITCH) SERIES

HIGH-DENSITY I/O CONNECTOR

General

DXM series high-density I/O connectors with bellow

contacts are perfect for tomorrow's miniaturized elec-

tronic devices. This new 1.27mm (0.050") interconnect

design ensures positive locking, effortless coupling,

terminal protection and EMI reduction in a miniaturized

and rugged package. DXM series offer you one of the

most varied and complete lines of High-Density con-

nectors in the world, i.e. IDC and Solder for the plug

and right angle dip, straight dip, IDC and SMT for the

receptacle. Available in 14, 20, 26, 36, 50, 68, 80, 100

and 110 way.

Features

1. 1.27mm (0.050") contact spacing conserves valu-

able board space and permits ultra-high density

designs.

penetration of external EMI noise.

6. Ferrite added to DX Right Angle Dip Type for EMI

Protection is available.

2. Bellow contacts create smooth and precise mating

and unmating.

3. Unique shell design assures first make/last break

grounding and overall noise protection.

4. IDC termination allows quick and low cost termina-

tion to AWG #28 wires.

7. Overmold backshell provided for ESD protection is

available in 'One-Touch' locking and 'Screw' lock-

ing.

8. Termination methods are available in IDC, Solder-

ing, Right Angle Dip, Straight Dip and SMT.

5. Backshell and receptacle shell are made of die-

cast zinc alloy or stainless steel to reduce the

Application

Specifications

Items

Standard value

Office Autmation, Computers, Measurement, Communication

and Control Equipment, Factory Automation, Home Automa-

tion and other commercial applications needing high density

interconnections.

Current capacity

Rated voltage

0.5A

AC125V

Insulation resistance 250M Ω or more at DC100V

Contact resistance 35m Ω or less at DC100mA

Withstanding voltage AC 300Vr.m.s. for 1 minute

223

04/2009

12 3 4 5 6 7...18

中文翻译

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与DX30AM-68P相关器件

型号	品牌	获取价格	描述	数据表
DX30AM-80P	HRS	获取价格	HIGH-DENSITY I/O CONNECTOR
DX30J-100P-CP3	HRS	获取价格	DX SERIES HIGH-DENSITY I/O CONNECTORS
DX30J-100P-CR2A	HRS	获取价格	DX SERIES HIGH-DENSITY I/O CONNECTORS
DX30J-100P-CR3	HRS	获取价格	DX SERIES HIGH-DENSITY I/O CONNECTORS
DX30J-100P-LNA	HRS	获取价格	DX SERIES HIGH-DENSITY I/O CONNECTORS
DX30J-100S-CP3	HRS	获取价格	DX SERIES HIGH-DENSITY I/O CONNECTORS
DX30J-100S-CR2A	HRS	获取价格	DX SERIES HIGH-DENSITY I/O CONNECTORS
DX30J-100S-CR3	HRS	获取价格	DX SERIES HIGH-DENSITY I/O CONNECTORS
DX30J-100SE	HRS	获取价格	DX SERIES HIGH-DENSITY I/O CONNECTORS
DX30J-100SE-CP3	HRS	获取价格	DX SERIES HIGH-DENSITY I/O CONNECTORS

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