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DSM020 PDF预览

DSM020

更新时间: 2024-11-24 01:22:59
品牌 Logo 应用领域
瞬雷 - SPSEMI /
页数 文件大小 规格书
2页 290K
描述
Surface Mount Devices

DSM020 数据手册

 浏览型号DSM020的Datasheet PDF文件第2页 
PPTC/DSM Series  
Features  
Surface Mount Devices  
Applications  
Almost anywhere there is a low voltage  
Lead free device  
power supply, up to 15V and a load to be  
protected, including:  
Size 1.5*0.8 mm / 0.06*0.03 inch  
Surface Mount packaging  
for automated assembly  
Computer mother board, Modem. USB hub  
PDAs & Charger, Analog & digital line card  
Digital cameras, Disk drivers, CD-ROMs,  
Dimensions(mm)  
A
0.7士0.1  
0.7 0.1  
B
1
1.00.1  
D
E
C
Product dimensions (mm)  
B
A
C
D
E
Model  
Min.  
1.45  
1.45  
1.45  
1.45  
1.45  
1.45  
1.45  
Max.  
1.85  
1.85  
1.85  
1.85  
1.85  
1.85  
1.85  
Min.  
0.65  
0.65  
0.65  
0.65  
0.65  
0.65  
0.65  
Max.  
1.05  
1.05  
1.05  
1.05  
1.05  
1.05  
1.05  
Min.  
0.40  
0.40  
0.40  
0.40  
0.50  
0.50  
0.50  
Max.  
Min.  
0.15  
0.15  
0.15  
0.15  
0.15  
0.15  
0.15  
Min.  
0.10  
0.10  
0.10  
0.10  
0.10  
0.10  
0.10  
DSM010  
DSM020  
DSM025  
DSM035  
DSM050  
DSM075  
DSM100  
1.00  
1.00  
1.00  
1.00  
1.10  
1.10  
1.10  
Environmental Specifications  
Conditions  
Test  
Resistance change  
±5% typical  
Passive aging  
Humidity aging  
Thermal shock  
+85°C, 1000 hrs.  
+85°C, 85% R.H. , 168 hours  
+85°C to -40°C, 20 times  
MIL-STD-202,Method 215  
MIL-STD-202,Method 201  
±5% typical  
±33% typical  
No change  
Resistance to solvent  
Vibration  
No change  
Ambient operating conditions : - 40 °C to +85 °C  
Maximum surface temperature of the device in the tripped state is 125 °C  
Termination pad characteristics  
Terminal pad materials  
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper  
Terminal pad solderability  
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.  
01 | www.spsemi.cn  
REV.2014.05.01  

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