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DS3174N PDF预览

DS3174N

更新时间: 2024-01-03 03:50:59
品牌 Logo 应用领域
达拉斯 - DALLAS /
页数 文件大小 规格书
232页 2033K
描述
Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers

DS3174N 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400针数:400
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.82JESD-30 代码:S-PBGA-B400
JESD-609代码:e1长度:27 mm
湿度敏感等级:3功能数量:1
端子数量:400最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA400,20X20,50
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified座面最大高度:2.54 mm
子类别:Other Telecom ICs最大压摆率:0.725 mA
标称供电电压:3.3 V表面贴装:YES
电信集成电路类型:FRAMER温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:27 mm
Base Number Matches:1

DS3174N 数据手册

 浏览型号DS3174N的Datasheet PDF文件第6页浏览型号DS3174N的Datasheet PDF文件第7页浏览型号DS3174N的Datasheet PDF文件第8页浏览型号DS3174N的Datasheet PDF文件第10页浏览型号DS3174N的Datasheet PDF文件第11页浏览型号DS3174N的Datasheet PDF文件第12页 
DS3171/DS3172/DS3173/DS3174  
Figure 10-20. HDLC Controller Block Diagram ......................................................................................................... 96  
Figure 10-21. Trail Trace Controller Block Diagram.................................................................................................. 99  
Figure 10-22. Trail Trace Byte (DT = Trail Trace Data)........................................................................................... 101  
Figure 10-23. FEAC Controller Block Diagram........................................................................................................ 102  
Figure 10-24. FEAC Codeword Format................................................................................................................... 103  
Figure 10-25. Line Encoder/Decoder Block Diagram.............................................................................................. 104  
Figure 10-26. B3ZS Signatures ............................................................................................................................... 106  
Figure 10-27. HDB3 Signatures............................................................................................................................... 106  
Figure 10-28. BERT Block Diagram ........................................................................................................................ 107  
Figure 10-29. PRBS Synchronization State Diagram.............................................................................................. 109  
Figure 10-30. Repetitive Pattern Synchronization State Diagram........................................................................... 110  
Figure 10-31. LIU Functional Diagram..................................................................................................................... 111  
Figure 10-32. DS3/E3 LIU Block Diagram............................................................................................................... 112  
Figure 10-33. Receiver Jitter Tolerance .................................................................................................................. 115  
Figure 13-1. JTAG Block Diagram........................................................................................................................... 207  
Figure 13-2. JTAG TAP Controller State Machine .................................................................................................. 208  
Figure 13-3. JTAG Functional Timing...................................................................................................................... 211  
Figure 14-1. DS3174 Pin Assignments—400-Lead BGA........................................................................................ 212  
Figure 14-2. DS3173 Pin Assignments—400-Lead BGA........................................................................................ 213  
Figure 14-3. DS3172 Pin Assignments—400-Lead BGA........................................................................................ 213  
Figure 14-4. DS3171 Pin Assignments—400-Lead BGA........................................................................................ 214  
Figure 15-1. Mechanical Dimensions—400-Lead BGA........................................................................................... 215  
Figure 15-2. Mechanical Dimensions (continued) ................................................................................................... 216  
Figure 18-1. Clock Period and Duty Cycle Definitions............................................................................................. 220  
Figure 18-2. Rise Time, Fall Time, and Jitter Definitions ........................................................................................ 220  
Figure 18-3. Hold, Setup, and Delay Definitions (Rising Clock Edge) .................................................................... 220  
Figure 18-4. Hold, Setup, and Delay Definitions (Falling Clock Edge).................................................................... 221  
Figure 18-5. To/From Hi Z Delay Definitions (Rising Clock Edge).......................................................................... 221  
Figure 18-6. To/From Hi Z Delay Definitions (Falling Clock Edge) ......................................................................... 221  
Figure 18-7. Micro Interface Nonmultiplexed Read/Write Cycle ............................................................................. 225  
Figure 18-8. Micro Interface Multiplexed Read Cycle.............................................................................................. 226  
Figure 18-9. E3 Waveform Template....................................................................................................................... 228  
Figure 18-10. DS3 Pulse Mask Template................................................................................................................ 229  
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