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DS3142N PDF预览

DS3142N

更新时间: 2024-01-18 13:59:41
品牌 Logo 应用领域
美信 - MAXIM 电信电信集成电路
页数 文件大小 规格书
88页 1151K
描述
Framer, PBGA144, 13 X 13 MM, CSBGA-144

DS3142N 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:13 X 13 MM, CSBGA-144针数:144
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:5.68JESD-30 代码:S-PBGA-B144
长度:13 mm湿度敏感等级:3
功能数量:1端子数量:144
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):240认证状态:Not Qualified
座面最大高度:1.75 mm标称供电电压:3.3 V
表面贴装:YES电信集成电路类型:FRAMER
温度等级:INDUSTRIAL端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:20宽度:13 mm
Base Number Matches:1

DS3142N 数据手册

 浏览型号DS3142N的Datasheet PDF文件第1页浏览型号DS3142N的Datasheet PDF文件第2页浏览型号DS3142N的Datasheet PDF文件第4页浏览型号DS3142N的Datasheet PDF文件第5页浏览型号DS3142N的Datasheet PDF文件第6页浏览型号DS3142N的Datasheet PDF文件第7页 
DS3141/DS3142/DS3143/DS3144 Single/Dual/Triple/Quad DS3/E3 Framers  
7.10.2 Transmit Operation .............................................................................................................................. 54  
7.10.3 HDLC Register Description.................................................................................................................. 54  
7.11  
FEAC CONTROLLER ............................................................................................................... 62  
7.11.1 FEAC Register Description.................................................................................................................. 63  
8. OPERATION DETAILS ................................................................................................................. 67  
8.1 RESET....................................................................................................................................... 67  
8.2 DS3 AND E3 MODE CONFIGURATION .......................................................................................... 67  
8.3 LIU AND SYSTEM INTERFACE CONFIGURATION............................................................................. 67  
8.4 LOOPBACK MODES..................................................................................................................... 68  
8.5 TRANSMIT OVERHEAD INSERTION................................................................................................ 68  
9. JTAG INFORMATION................................................................................................................... 69  
9.1 JTAG TAP CONTROLLER STATE MACHINE.................................................................................. 69  
9.2 JTAG INSTRUCTION REGISTER AND INSTRUCTIONS...................................................................... 71  
9.3 JTAG SCAN REGISTERS............................................................................................................. 72  
10. DC ELECTRICAL CHARACTERISTICS....................................................................................... 73  
11. AC TIMING CHARACTERISTICS................................................................................................. 74  
11.1  
11.2  
11.3  
SYSTEM INTERFACE TIMING..................................................................................................... 74  
MICROPROCESSOR INTERFACE TIMING..................................................................................... 76  
JTAG INTERFACE TIMING ........................................................................................................ 81  
12. PIN ASSIGNMENTS ..................................................................................................................... 82  
13. PACKAGE INFORMATION........................................................................................................... 87  
14. THERMAL INFORMATION........................................................................................................... 88  
15. REVISION HISTORY..................................................................................................................... 88  
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