是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOC, | 针数: | 6 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.71 | Factory Lead Time: | 6 weeks |
风险等级: | 5.74 | JESD-30 代码: | R-PDSO-C6 |
JESD-609代码: | e3 | 长度: | 3.94 mm |
内存密度: | 64 bit | 内存集成电路类型: | OTP ROM |
内存宽度: | 1 | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 6 |
字数: | 64 words | 字数代码: | 64 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 64X1 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOC |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
并行/串行: | SERIAL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
认证状态: | Not Qualified | 座面最大高度: | 1.5 mm |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 2.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | C BEND | 端子节距: | 1.27 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3.76 mm | Base Number Matches: | 1 |
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