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DS26522GN+ PDF预览

DS26522GN+

更新时间: 2024-02-20 21:52:02
品牌 Logo 应用领域
美信 - MAXIM /
页数 文件大小 规格书
258页 1756K
描述
Dual T1/E1/J1 Transceiver

DS26522GN+ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:ROHS COMPLIANT, CSBGA-144针数:144
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.82
运营商类型:CEPT PCM-30/E-1运营商类型(2):T-1(DS1)
JESD-30 代码:S-PBGA-B144JESD-609代码:e1
长度:13 mm湿度敏感等级:3
功能数量:1端子数量:144
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA144,12X12,40封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
座面最大高度:1.75 mm子类别:Other Telecom ICs
最大压摆率:0.22 mA标称供电电压:3.3 V
表面贴装:YES电信集成电路类型:TIME SLOT 0/16 TRANSCEIVER
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:13 mmBase Number Matches:1

DS26522GN+ 数据手册

 浏览型号DS26522GN+的Datasheet PDF文件第1页浏览型号DS26522GN+的Datasheet PDF文件第3页浏览型号DS26522GN+的Datasheet PDF文件第4页浏览型号DS26522GN+的Datasheet PDF文件第5页浏览型号DS26522GN+的Datasheet PDF文件第6页浏览型号DS26522GN+的Datasheet PDF文件第7页 
DS26522 Dual T1/E1/J1 Transceiver  
TABLE OF CONTENTS  
1.  
2.  
DETAILED DESCRIPTION...............................................................................................9  
1.1 MAJOR OPERATING MODES.............................................................................................................9  
FEATURE HIGHLIGHTS ................................................................................................10  
2.1 GENERAL......................................................................................................................................10  
2.2 LINE INTERFACE............................................................................................................................10  
2.3 CLOCK SYNTHESIZER ....................................................................................................................10  
2.4 JITTER ATTENUATOR .....................................................................................................................10  
2.5 FRAMER/FORMATTER ....................................................................................................................10  
2.6 SYSTEM INTERFACE ......................................................................................................................11  
2.7 HDLC CONTROLLERS ...................................................................................................................12  
2.8 TEST AND DIAGNOSTICS ................................................................................................................12  
2.9 MICROCONTROLLER PARALLEL PORT.............................................................................................12  
2.10  
SLAVE SERIAL PERIPHERAL INTERFACE (SPI) FEATURES ............................................................12  
3.  
4.  
5.  
6.  
7.  
APPLICATIONS..............................................................................................................13  
SPECIFICATIONS COMPLIANCE .................................................................................14  
ACRONYMS AND GLOSSARY......................................................................................16  
BLOCK DIAGRAMS.......................................................................................................17  
PIN DESCRIPTIONS ......................................................................................................19  
7.1 PIN FUNCTIONAL DESCRIPTION......................................................................................................19  
FUNCTIONAL DESCRIPTION........................................................................................25  
8.1 MICROPROCESSOR INTERFACE......................................................................................................25  
8.  
8.1.1  
8.1.2  
8.1.3  
Parallel Port Mode................................................................................................................................ 25  
SPI Serial Port Mode............................................................................................................................ 25  
SPI Functional Timing Diagrams ......................................................................................................... 25  
8.2 CLOCK STRUCTURE.......................................................................................................................28  
8.2.1 Backplane Clock Generation ............................................................................................................... 28  
8.3 RESETS AND POWER-DOWN MODES..............................................................................................29  
8.4 INITIALIZATION AND CONFIGURATION..............................................................................................30  
8.4.1  
Example Device Initialization Sequence.............................................................................................. 30  
8.5 GLOBAL RESOURCES ....................................................................................................................30  
8.6 PORT RESOURCES ........................................................................................................................30  
8.7 DEVICE INTERRUPTS .....................................................................................................................30  
8.8 SYSTEM BACKPLANE INTERFACE ...................................................................................................32  
8.8.1  
8.8.2  
8.8.3  
8.8.4  
8.8.5  
8.8.6  
Elastic Stores ....................................................................................................................................... 32  
IBO Multiplexer..................................................................................................................................... 35  
H.100 (CT Bus) Compatibility .............................................................................................................. 36  
Receive and Transmit Channel Blocking Registers............................................................................. 37  
Transmit Fractional Support (Gapped Clock Mode) ............................................................................ 37  
Receive Fractional Support (Gapped Clock Mode) ............................................................................. 37  
8.9 FRAMERS......................................................................................................................................38  
8.9.1  
8.9.2  
8.9.3  
8.9.4  
8.9.5  
8.9.6  
8.9.7  
T1 Framing........................................................................................................................................... 38  
E1 Framing........................................................................................................................................... 41  
T1 Transmit Synchronizer.................................................................................................................... 43  
Signaling .............................................................................................................................................. 44  
T1 Data Link......................................................................................................................................... 48  
E1 Data Link......................................................................................................................................... 50  
Maintenance and Alarms ..................................................................................................................... 51  
2 of 258  

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