是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | End Of Life | 零件包装代码: | SOT-23 |
包装说明: | TSSOP, TO-236 | 针数: | 3 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.29 |
Is Samacsys: | N | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | R-PDSO-G3 |
JESD-609代码: | e3 | 长度: | 2.92 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 3 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TO-236 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
电源: | 1.2/5.5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.12 mm | 子类别: | Power Management Circuits |
最大供电电流 (Isup): | 0.035 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 标称供电电压 (Vsup): | 3.3 V | |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | GULL WING | 端子节距: | 0.95 mm |
端子位置: | DUAL | 阈值电压标称: | +2.55V |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 1.3 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MAX817LEPA+ | MAXIM |
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