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DS15BR400TSQ PDF预览

DS15BR400TSQ

更新时间: 2024-02-19 03:20:02
品牌 Logo 应用领域
美国国家半导体 - NSC 线路驱动器或接收器驱动程序和接口接口集成电路中继器
页数 文件大小 规格书
11页 645K
描述
4-Channel LVDS Buffer/Repeater with Pre-Emphasis

DS15BR400TSQ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:TFQFP, TQFP48,.35SQ
Reach Compliance Code:compliantECCN代码:5A991.B.1
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:1.25Samacsys Description:LVDS Interface IC 4ch LVDS Buffer/Repeater
差分输出:YES驱动器位数:4
输入特性:DIFFERENTIAL接口集成电路类型:LINE TRANSCEIVER
接口标准:GENERAL PURPOSEJESD-30 代码:S-PQFP-G48
JESD-609代码:e3长度:7 mm
湿度敏感等级:3功能数量:4
端子数量:48最高工作温度:85 °C
最低工作温度:-40 °C最小输出摆幅:2 V
输出特性:DIFFERENTIAL最大输出低电流:0.00001 A
输出极性:COMPLEMENTARY封装主体材料:PLASTIC/EPOXY
封装代码:TFQFP封装等效代码:TQFP48,.35SQ
封装形状:SQUARE封装形式:FLATPACK, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified最大接收延迟:2 ns
接收器位数:4座面最大高度:1.2 mm
子类别:Line Driver or Receivers最大压摆率:215 mA
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V电源电压1-最大:3.6 V
电源电压1-分钟:3 V电源电压1-Nom:3.3 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED最大传输延迟:2 ns
宽度:7 mm

DS15BR400TSQ 数据手册

 浏览型号DS15BR400TSQ的Datasheet PDF文件第5页浏览型号DS15BR400TSQ的Datasheet PDF文件第6页浏览型号DS15BR400TSQ的Datasheet PDF文件第7页浏览型号DS15BR400TSQ的Datasheet PDF文件第9页浏览型号DS15BR400TSQ的Datasheet PDF文件第10页浏览型号DS15BR400TSQ的Datasheet PDF文件第11页 
INPUT FAILSAFE BIASING  
Application Information  
External pull up and pull down resistors may be used to  
provide enough of an offset to enable an input failsafe under  
open-circuit conditions. This configuration ties the positive  
LVDS input pin to VDD thru a pull up resistor and the negative  
LVDS input pin is tied to GND by a pull down resistor. The  
pull up and pull down resistors should be in the 5kto 15kΩ  
range to minimize loading and waveform distortion to the  
driver. The common-mode bias point ideally should be set to  
approximately 1.2V. Please refer to application note AN-  
1194 “Failsafe Biasing of LVDS Interfaces” for more informa-  
tion.  
INTERNAL TERMINATIONS  
The DS15BR400 has integrated termination resistors on  
both the input and outputs. The inputs have a 100resistor  
across the differential pair, placing the receiver termination  
as close as possible to the input stage of the device. The  
LVDS outputs also contain an integrated 100ohm termi-  
nation resistor, this resistor is used to minimize the output  
return loss and does not take the place of the 100 ohm  
termination at the inputs to the receiving device. The inte-  
grated terminations improve signal integrity and decrease  
the external component count resulting in space savings.  
The DS15BR401 has 100output terminations only.  
DECOUPLING  
Each power or ground lead of the DS15BR400 should be  
connected to the PCB through a low inductance path. For  
best results, one or more vias are used to connect a power  
or ground pin to the nearby plane. Ideally, via placement is  
immediately adjacent to the pin to avoid adding trace induc-  
tance. Placing power plane closer to the top of the board  
reduces effective via length and its associated inductance.  
OUTPUT CHARACTERISTICS  
The output characteristics of the DS15BRB400/DS15BR401  
have been optimized for point-to-point backplane and cable  
applications, and are not intended for multipoint or multidrop  
signaling.  
Bypass capacitors should be placed close to VDD pins.  
Small physical size capacitors, such as 0402, X7R, surface  
mount capacitors should be used to minimize body induc-  
tance of capacitors. Each bypass capacitor is connected to  
the power and ground plane through vias tangent to the pads  
of the capacitor. An X7R surface mount capacitor of size  
0402 has about 0.5 nH of body inductance. At frequencies  
above 30 MHz or so, X7R capacitors behave as low imped-  
ance inductors. To extend the operating frequency range to a  
few hundred MHz, an array of different capacitor values like  
100 pF, 1 nF, 0.03 µF, and 0.1 µF are commonly used in  
parallel. The most effective bypass capacitor can be built  
using sandwiched layers of power and ground at a separa-  
tion of 2–3 mils. With a 2 mil FR4 dielectric, there is approxi-  
mately 500 pF per square inch of PCB.  
POWERDOWN MODE  
The PWDN input activates a hardware powerdown mode.  
When the powerdown mode is active (PWDN=L), all input  
and output buffers and internal bias circuitry are powered off.  
When exiting powerdown mode, there is a delay associated  
with turning on bandgap references and input/output buffer  
circuits as indicated in the LVDS Output Switching Charac-  
teristics  
PRE-EMPHASIS  
Pre-emphasis dramatically reduces ISI jitter from long or  
lossy transmission media. One pin is used to select the  
pre-emphasis level for all outputs, off or on. The pre-  
emphasis boost is approximately 6 dB at 750 MHz.  
The center dap of the LLP package housing the DS15BR400  
should be connected to a ground plane through an array of  
vias. The via array reduces the effective inductance to  
ground and enhances the thermal performance of the LLP  
package.  
Pre-emphasis Control Selection Table  
PEM  
Pre-Emphasis  
0
1
Off  
On  
www.national.com  
8

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