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DS1013M-50+ PDF预览

DS1013M-50+

更新时间： 2024-11-21 20:00:35
品牌 Logo 应用领域
美信 - MAXIM 光电二极管输出元件逻辑集成电路延迟线
页数 文件大小 规格书
6页 57K
描述
Silicon Delay Line, 3-Func, 1-Tap, True Output, CMOS, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001AB, DIP-8

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中文翻译

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DS1013M-50+ 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：DIP包装说明：DIP,
针数：8Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.39.00.01
风险等级：5.57其他特性：BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT
系列：CMOSJESD-30 代码：R-PDIP-T8
JESD-609代码：e3长度：9.375 mm
逻辑集成电路类型：SILICON DELAY LINE功能数量：3
抽头/阶步数：1端子数量：8
最高工作温度：70 °C最低工作温度：
输出极性：TRUE封装主体材料：PLASTIC/EPOXY
封装代码：DIP封装形状：RECTANGULAR
封装形式：IN-LINE峰值回流温度（摄氏度）：260
可编程延迟线：NO认证状态：Not Qualified
座面最大高度：4.572 mm最大供电电压 (Vsup)：5.25 V
最小供电电压 (Vsup)：4.75 V标称供电电压 (Vsup)：5 V
表面贴装：NO技术：CMOS
温度等级：COMMERCIAL端子面层：MATTE TIN
端子形式：THROUGH-HOLE端子节距：2.54 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
总延迟标称（td）：50 ns宽度：7.62 mm
Base Number Matches：1

DS1013M-50+ 数据手册

 浏览型号DS1013M-50+的Datasheet PDF文件第2页浏览型号DS1013M-50+的Datasheet PDF文件第3页浏览型号DS1013M-50+的Datasheet PDF文件第4页浏览型号DS1013M-50+的Datasheet PDF文件第5页浏览型号DS1013M-50+的Datasheet PDF文件第6页 
DS1013  
3-in-1 Silicon Delay Line  
www.dalsemi.com  
FEATURES  
PIN ASSIGNMENT  
ꢀ All-silicon time delay  
IN 1  
NC  
1
2
14  
13  
12  
11  
10  
9
VCC  
NC  
ꢀ 3 independent buffered delays  
ꢀ Delay tolerance ±2ns for -10 through –60  
ꢀ Stable and precise over temperature and  
voltage range  
ꢀ Leading and trailing edge accuracy  
ꢀ Economical  
ꢀ Auto-insertable, low profile  
ꢀ Standard 14-pin DIP, 8-pin DIP, or 16-pin  
SOIC  
IN 1  
NC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
VCC  
NC  
IN 2  
NC  
3
4
5
6
7
OUT 1  
NC  
NC  
NC  
IN 2  
OUT 1  
NC  
NC  
IN 3  
NC  
IN 3  
OUT 2  
NC  
OUT 2  
NC  
NC  
8
GND  
OUT 3  
GND  
OUT 3  
DS1013 14-pin DIP (300-mil)  
See Mech. Drawings Section  
DS1013S 16-pin SOIC  
(300-mil)  
ꢀ Low-power CMOS  
ꢀ TTL/CMOS-compatible  
ꢀ Vapor phase, IR and wave solderable  
ꢀ Custom delays available  
ꢀ Quick turn prototypes  
See Mech. Drawings Section  
1
VCC  
8
7
IN 1  
2
IN 2  
OUT 1  
OUT 2  
OUT 3  
ꢀ Extended temperature ranges available  
3
6
5
IN 3  
4
GND  
DS1013M 8-pin DIP (300-mil)  
See Mech. Drawings Section  
PIN DESCRIPTION  
IN 1, IN 2, IN 3  
- Inputs  
OUT 1, OUT 2, OUT 3 - Outputs  
GND  
VCC  
NC  
- Ground  
- +5 Volts  
- No Connection  
DESCRIPTION  
The DS1013 series of delay lines has three independent logic buffered delays in a single package. The  
devices are offered in a standard 14-pin DIP which is pin-compatible with hybrid delay lines. Alternative  
8-pin DIP and surface mount packages are available which save PC board area. Since the DS1013  
products are an all silicon solution, better economy is achieved when compared to older methods using  
hybrid techniques. The DS1013 series delay lines provide a nominal accuracy of ±2ns for delay times  
ranging from 10 ns to 60 ns, increasing to 5% for delays of 150 ns and longer. The DS1013 delay line  
reproduces the input logic state at the output after a fixed delay as specified by the dash number extension  
of the part number. The DS1013 is designed to reproduce both leading and trailing edges with equal  
precision. Each output is capable of driving up to 10 74LS loads. Dallas Semiconductor can customize  
standard products to meet special needs. For special requests and rapid delivery, call (972) 371–4348.  
1 of 6  
111799  
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DS1013M-75+ ROCHESTER

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