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DP-X32-10 Series
RF Components
Diplexers
For Dual Band
FEATURES
APPLICATIONS
Dual band/dual mode cellular use
• Sheet multilayer construction has resulted in the miniaturized,
light weight chip diplexers(L3.2× W2.5×T1.2mm, 31mg).
• The industry’s smallest class diplexers maintain high grade, high
stability characteristics for dual band/dual mode cellular transmis-
sion and reception. These diplexers have good separation charac-
teristics, achieving both low insertion loss and high stopband
attenuation.
TEMPERATURE RANGES
Operating
Storage
–30 to +80°C
–40 to +85°C
•
This series provides a choice of two product types corresponding
to the most typical dual band systems:AMPS/PCS1900(USA)
and GSM/DCS1800(Europe).
• Since these diplexers are provided with outstanding resistance
to damage from the physical and chemical environment, stable
characteristics are maintained, even for cellular applications
under severe conditions.
RECOMMENDED PC BOARD PATTERN
REFLOW SOLDERING
SHAPES AND DIMENSIONS/CIRCUIT DIAGRAM
AMPS
PCS1900
GSM GND DCS1800
0.4
0.6
0.8
0.6
0.4
0.6
1
2
3
Marking
(
)
01 DPX321990DT-1001
AMPS/PCS1900
(
)
02 DPX321880DT-1002
GSM/DCS1800
6
5
4
AMPS
GSM
PCS1900
DCS1800
GND COMMON GND
GND
2
1
6
3
4
3.2±0.2
1±0.2 1±0.2
0.55±0.2
0.45±0.2
5
GND COMMON GND
6-ø0.4
Weight: 31mg
0.6
Dimensions in mm
50Ω impedance microstrip line
(
)
0.4mm epoxy substrate
EQUIVALENT CIRCUIT DIAGRAM
Dimensions in mm
COMMON
5
RECOMMENDED REFLOW SOLDERING CONDITIONS
01
01
AMPS
824 to 894MHz
PCS1900
1.85 to 1.99GHz
LPF
HPF
Natural
cooling
240˚C max.
230˚C
1
3
02
02
200˚C
GSM
DCS1800
890 to 960MHz
1.71 to 1.88GHz
10s max.
GND GND
GND
150˚C
40s max.
120s max.
( )
Time s
• All specifications are subject to change without notice.