741_DPX32
(1/2)
DP-X32-10 Series
RF Components
Diplexers
For Dual Band
FEATURES
APPLICATIONS
• Sheet multilayer construction has resulted in the miniaturized,
light weight chip diplexers(L3.2× W2.5×T1.2mm, 31mg).
• The industry’s smallest class diplexers maintain high grade, high
stability characteristics for dual band/dual mode cellular transmis-
sion and reception. These diplexers have good separation charac-
teristics, achieving both low insertion loss and high stopband
attenuation.
Dual band/dual mode cellular use
TEMPERATURE RANGES
Operating
Storage
–30 to +80°C
–40 to +85°C
•
This series provides a choice of two product types corresponding
to the most typical dual band systems:AMPS/PCS1900(USA)
and GSM/DCS1800(Europe).
• Since these diplexers are provided with outstanding resistance
to damage from the physical and chemical environment, stable
characteristics are maintained, even for cellular applications
under severe conditions.
SHAPES AND DIMENSIONS/CIRCUIT DIAGRAM
RECOMMENDED PC BOARD PATTERN
REFLOW SOLDERING
AMPS
PCS1900
GSM GND DCS1800
1
2
3
0.4
0.6
0.8
0.6
0.4
0.6
Marking
(
)
01 DPX321990DT-1001
AMPS/PCS1900
(
)
02 DPX321880DT-1002
GSM/DCS1800
6
5
4
GND COMMON GND
AMPS
GSM
PCS1900
DCS1800
3.2±0.2
GND
2
1
6
3
4
1±0.2 1±0.2
0.55±0.2
0.45±0.2
5
GND COMMON GND
6-ø0.4
Weight: 31mg
0.6
Dimensions in mm
50Ω impedance microstrip line
(
)
0.4mm epoxy substrate
EQUIVALENT CIRCUIT DIAGRAM
Dimensions in mm
COMMON
5
RECOMMENDED REFLOW SOLDERING CONDITIONS
01
01
AMPS
824 to 894MHz
PCS1900
1.85 to 1.99GHz
LPF
HPF
Natural
cooling
240°C max.
230°C
1
3
02
02
200°C
GSM
DCS1800
890 to 960MHz
1.71 to 1.88GHz
10s max.
GND GND
GND
150°C
40s max.
120s max.
( )
Time s
Specifications which provide more details for the proper and safe use of the described product are available upon request.
All specifications are subject to change without notice.