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DP83630

更新时间： 2024-01-17 17:03:41
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
135页 1447K
描述
DP83630 Precision PHYTER™ - IEEE 1588 Precision Time Protocol Transceiver

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中文翻译

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DP83630 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：HVQCCN,
Reach Compliance Code：compliantECCN代码：5A991.B.1
HTS代码：8542.39.00.01Factory Lead Time：6 weeks
风险等级：1.67差分输出：YES
驱动器位数：1高电平输入电流最大值：0.00001 A
输入特性：DIFFERENTIAL接口集成电路类型：LINE TRANSCEIVER
接口标准：IEEE 1588JESD-30 代码：S-PQCC-N48
JESD-609代码：e3长度：7 mm
湿度敏感等级：2功能数量：1
端子数量：48最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：PLASTIC/EPOXY
封装代码：HVQCCN封装形状：SQUARE
封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度（摄氏度）：260
最大接收延迟：接收器位数：1
座面最大高度：0.8 mm最大供电电压：3.6 V
最小供电电压：3 V标称供电电压：3.3 V
电源电压1-最大：3.6 V电源电压1-分钟：3 V
电源电压1-Nom：3.3 V表面贴装：YES
温度等级：INDUSTRIAL端子面层：Matte Tin (Sn)
端子形式：NO LEAD端子节距：0.5 mm
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：7 mmBase Number Matches：1

DP83630 数据手册

 浏览型号DP83630的Datasheet PDF文件第128页浏览型号DP83630的Datasheet PDF文件第129页浏览型号DP83630的Datasheet PDF文件第130页浏览型号DP83630的Datasheet PDF文件第132页浏览型号DP83630的Datasheet PDF文件第133页浏览型号DP83630的Datasheet PDF文件第134页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
DP83630SQ/NOPB  
DP83630SQE/NOPB  
DP83630SQX/NOPB  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
WQFN  
WQFN  
WQFN  
RHS  
48  
48  
48  
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
CU SN  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
DP83630SQ  
ACTIVE  
ACTIVE  
RHS  
RHS  
250  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
DP83630SQ  
DP83630SQ  
2500  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
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中文翻译

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