DMN6069SEQ
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
VDSS
Value
60
Unit
V
Gate-Source Voltage
±20
V
VGSS
TA = +25°C
4.3
3.3
A
A
ID
TA = +70°C
TC = +25°C
TC = +70°C
Continuous Drain Current (Note 5) VGS = 10V
10
8
ID
IDM
IS
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Maximum Body Diode Continuous Current
Avalanche Current, L = 3mH
25
4.3
5
A
A
A
IAS
EAS
Avalanche Energy, L = 3mH
37.5
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
PD
Value
2.2
Unit
W
Total Power Dissipation (Note 5)
TA = +25°C
TA = +25°C
TC = +25°C
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
58
°C/W
W
RθJA
PD
1.2
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 5)
100
11
°C/W
W
RθJA
PD
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
8.9
°C/W
RθJC
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
Test Condition
—
—
—
60
—
—
—
1
V
BVDSS
IDSS
VGS = 0V, ID = 250μA
VDS = 60V, VGS = 0V
VGS = ±20V, VDS = 0V
μA
nA
±100
IGSS
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
1
—
47
54
0.8
3
V
mΩ
V
VGS(TH)
RDS(ON)
VSD
VDS = VGS, ID = 250μA
VGS = 10V, ID = 3A
VGS = 4.5V, ID = 2.4A
VGS = 0V, IS = 2.5A
—
—
—
69
Static Drain-Source On-Resistance
100
1.1
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
825
40
Ciss
Coss
Crss
RG
VDS = 30V, VGS = 0V
f = 1MHz
Output Capacitance
pF
29
Reverse Transfer Capacitance
Gate Resistance
2.3
7.2
16
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Qg
Qg
nC
VDS = 30V, ID = 12A
3.2
2.8
3.8
6.7
16
Qgs
Qgd
tD(ON)
tR
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
VDD = 30V, VGS = 10V
RG = 6Ω, ID = 12A
ns
Turn-Off Delay Time
tD(OFF)
tF
Turn-Off Fall Time
5.3
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
2 of 7
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February 2023
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DMN6069SEQ
Document number: DS44584 Rev. 2 - 2