Datasheet > DLA 95158

DLA 95158

更新时间： 2023-12-06 20:03:04

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
15页	416K
描述
Solid Tantalum Surface Mount Capacitors TANTAMOUNT?, Molded Case, DLA Approved, Low ESR

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DLA 95158 数据手册

DLA 95158

www.vishay.com

Vishay

Solid Tantalum Surface Mount Chip Capacitors

TANTAMOUNT™, Molded Case, DLA Approved, Low ESR

FEATURES

• Meets MIL-PRF-55365 mechanical and performance

requirements

• Low ESR

• Terminations: gold and tin / lead solder plated

• Molded case available in 3 case codes

• High ripple current carrying capability

• High reliability

• Moisture sensitivity level 1

Inspection: MIL-PRF-55365, group

(exponential distribution); subgroups 1 and 3 with voltage

aging a minimum of 10 h.

inspection

PERFORMANCE / ELECTRICAL

CHARACTERISTICS

www.vishay.com/doc?40211

100 % Surge Current Tested

- Temperature: 25 °C

- Applied voltage: rated voltage

- Test cycles: 4

- Charge and discharge cycles: 4 s maximum

- Total DC resistance: 0.6 Ω maximum

Operating Temperature: -55 °C to +125 °C

(above 85 °C, voltage derating is required)

Capacitance Range: 4.7 μF to 220 μF

Capacitance Tolerance: 10 ꢀ, and 20 ꢀ

Voltage Rating: 6 V_DCto 50 V_DC

Note

APPLICATIONS

• Military / aerospace

•

For recommended voltage derating guidelines see “Typical

Performance Characteristics”

ORDERING INFORMATION

95158-

DRAWING NUMBER

DASH NUMBER

CAPACITANCE

TOLERANCE

TERMINATION FINISH

PACKAGING

K = 10 ꢀ

M = 20 ꢀ

B = gold plated

(10 microinch minimum)

H = solder plated

(100 microinch

T = 7" (178 mm) reel

H = 7" (178 mm) reel,

½ full reel

minimum)

DIMENSIONS in inches [millimeters]

T_W

T_HMIN.

Glue Pad

CASE CODE

EIA SIZE

T_W

0.087 0.004

[2.2 0.10]

T_HMIN.

0.236 0.012

[6.0 0.30]

0.126 0.012

[3.2 0.30]

0.098 0.012

[2.5 0.30]

0.051 0.012

[1.3 0.30]

0.039

[1.0]

6032-28

0.287 0.012

[7.3 0.30]

0.170 0.012

[4.3 0.30]

0.110 0.012

[2.8 0.30]

0.051 0.012

[1.3 0.30]

0.095 0.004

[2.4 0.10]

0.039

[1.0]

7343-31

7343-43

0.287 0.012

[7.3 0.30]

0.170 0.012

[4.3 0.30]

0.158 0.012

[4.0 0.30]

0.051 0.012

[1.3 0.30]

0.095 0.004

[2.4 0.10]

0.039

[1.0]

Note

Glue pad (non-conductive, part of molded case) is dedicated for glue attachment (as user option)

•

Revision: 21-Nov-2023

Document Number: 40120

For technical questions, contact: tantalum@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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