DLA Moisture Resistant Chip Resistor
www.vishay.com
Vishay Dale Thin Film
Commercial Thin Film Chip Resistor,
Surface-Mount Chip
FEATURES
• Moisture resistant
• High purity alumina substrate
• Military, space level A and T available
• Will pass powered moisture resistance at 10 % rated
power
Actual Size
1505
• 100 % visual inspected per MIL-PRF-55342
• Non-inductive
LINKS TO ADDITIONAL RESOURCES
• Very low noise and voltage coefficient (< -30 dB)
• Wraparound resistance less than 10 m
• Tin lead solder terminations
3
D
3D Models
• Sulfur resistant (per ASTM B809-95 humid vapor test)
These chip resistors are available as “wraparound”
termination styles in a variety of sizes. They incorporate self
passivated, enhanced tantalum nitride films, to give superior
performance on moisture resistance, voltage coefficient,
power handling, and resistance stability. The terminations
consist of an adhesion layer, a leach resistant nickel barrier,
and solder coating. This product will out-perform all
requirements of characteristic E of MIL-PRF-55342.
TYPICAL PERFORMANCE
ABSOLUTE
TCR
TOL.
25
0.1
CONSTRUCTION
Tantalum nitride
resistive film
Passivation
Solder coating
Nickel barrier
High purity alumina substrate
Adhesion layer
STANDARD ELECTRICAL SPECIFICATIONS
TEST
SPECIFICATIONS
Tantalum nitride
10 to 3 M
CONDITIONS
Material
-
Resistance Range
TCR: Absolute
-
25 ppm/ꢀC to 300 ppm/ꢀC
0.1 % to 10 %
R 0.03 %
-55 ꢀC to +125 ꢀC
Tolerance: Absolute
Stability: Absolute
Stability: Ratio
+25 ꢀC
2000 h at 70 ꢀC
Not applicable
0.1 ppm/V
-
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
Noise
-
30 V to 200 V
-
-55 ꢀC to +155 ꢀC
-55 ꢀC to +155 ꢀC
< -30 dB
-
-
-
Shelf Life Stability: Absolute
100 ppm
1 year at 25 ꢀC
Revision: 06-Sep-2021
Document Number: 60163
1
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000