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DG411AL/883B PDF预览

DG411AL/883B

更新时间: 2024-11-30 08:49:59
品牌 Logo 应用领域
美信 - MAXIM 输出元件
页数 文件大小 规格书
6页 27K
描述
SPST, 4 Func, CMOS, CDFP16, FP-16

DG411AL/883B 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active包装说明:FP-16
Reach Compliance Code:not_compliant风险等级:5.39
模拟集成电路 - 其他类型:SPSTJESD-30 代码:R-XDFP-F16
正常位置:NC功能数量:4
端子数量:16最大通态电阻 (Ron):100 Ω
最高工作温度:125 °C最低工作温度:-55 °C
输出:SEPARATE OUTPUT封装主体材料:CERAMIC
封装代码:DFP封装等效代码:FL16,.3
封装形状:RECTANGULAR封装形式:FLATPACK
电源:5,12/+-15 V认证状态:Not Qualified
筛选级别:38535Q/M;38534H;883B子类别:Multiplexer or Switches
表面贴装:YES最长接通时间:250 ns
技术:CMOS温度等级:MILITARY
端子形式:FLAT端子节距:1.27 mm
端子位置:DUALBase Number Matches:1

DG411AL/883B 数据手册

 浏览型号DG411AL/883B的Datasheet PDF文件第2页浏览型号DG411AL/883B的Datasheet PDF文件第3页浏览型号DG411AL/883B的Datasheet PDF文件第4页浏览型号DG411AL/883B的Datasheet PDF文件第5页浏览型号DG411AL/883B的Datasheet PDF文件第6页 
SCOPE: IMPROVED, QUAD, SPST ANALOG SWITCHES  
Device Type  
Generic Number  
DG411A(x)/883B  
DG412A(x)/883B  
DG413A(x)/883B  
01  
02  
03  
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:  
Outline Letter  
Mil-Std-1835  
Case Outline  
Package Code  
MAXIM  
SMD  
K
L
Z
E
X
2
GDIP1-T16 or CDIP2-T16  
CDFP4-F16  
CQCC1-N20  
16 LEAD CERDIP  
16 LEAD FLATPACK  
20-Pin Ceramic LCC  
J16  
F16  
L20  
Absolute Maximum Ratings  
V+ to V- .............................................................................................................................. 44V  
GND to V- ......................................................................................................................... 25V  
Logic Supply Voltage (VL) to V- 2/ .................................................... (GND-0.3V) to 44Vdc  
Digital Inputs, VS, VD 2/ .................................................................(V -) -2Vdc to (V+) +2Vdc  
or 30mA whichever occurs first.  
Continuous Current, Any terminal .................................................................................. 30mA  
Source or drain Current (Pulsed at 1ms, 10% duty cycle max) .................................... 100mA  
Lead Temperature (soldering, 10 seconds) ...............................................................…..... +300°C  
Storage Temperature ........................................................................................... -65°C to +150°C  
Continuous Power Dissipation .........................................................................…….... TA=+70°C  
16 lead CERDIP(derate 10.0mW/°C above +70°C) ...............................................…….. 800mW  
16 lead FLATPACK(derate 6.1mW/°C above +70°C) .........................................…….... 485mW  
20 lead LCC (derate 9.1 mW/°C above +70°C) ..................................................……..... 727mW  
Junction Temperature TJ ....................................................................................………. +150°C  
Thermal Resistance, Junction to Case, ΘJC:  
Case Outline 16 lead CERDIP...............................................................……..... 50°C/W  
Case Outline 16 lead FLATPACK .........................................................……... 65°C/W  
Case Outline 20 lead LCC .....................................................................…….... 20°C/W  
Thermal Resistance, Junction to Ambient, ΘJA:  
Case Outline 16 lead CERDIP.............................................................……..... 100°C/W  
Case Outline 16 lead FLATPACK .......................................................……... 165°C/W  
Case Outline 20 lead LCC ...................................................................…….... 110°C/W  
Recommended Operating Conditions  
Ambient Operating Range (TA) ........................................................……….... -55°C to +125°C  
Unipolar Supply Voltage (V+) ...............................................................................………….12V  
(V-) ................................................................................………….. 0V  
Bipolar Supply Voltage (V+) ...............................................................................…………. 15V  
(V-) ..............................................................................………….. 15V  
Logic Supply Voltage (VL) ....................................................................................…….. +5.25V  
NOTE 1: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the  
device. These are stress ratings only, and functional operation of the device at these or any other  
conditions beyond those indicated in the operational sections of the specifications is not implied.  
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
NOTE 2: Signals on SX, DX or INX exceeding V+ or V- are clamped by internal diodes. Limit forward current to  
maximum current ratings.  
----------------------------  
Electrical Characteristics of DG411A/412A  
/413A /883B for SMD 5962-90731  
19-0338  
Page 2 of  
Rev. B  
10  

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