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DG307AAK/883B PDF预览

DG307AAK/883B

更新时间: 2024-11-19 18:36:35
品牌 Logo 应用领域
美信 - MAXIM 光电二极管输出元件
页数 文件大小 规格书
4页 27K
描述
SPDT, 2 Func, CMOS, CDIP14

DG307AAK/883B 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:ActiveReach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.81模拟集成电路 - 其他类型:SPDT
JESD-30 代码:R-XDIP-T14JESD-609代码:e0
湿度敏感等级:1标称负供电电压 (Vsup):-15 V
功能数量:2端子数量:14
最大通态电阻 (Ron):75 Ω最高工作温度:125 °C
最低工作温度:-55 °C输出:SEPARATE OUTPUT
封装主体材料:CERAMIC封装代码:DIP
封装等效代码:DIP14,.3封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):240
电源:+-15 V认证状态:Not Qualified
筛选级别:38535Q/M;38534H;883B子类别:Multiplexer or Switches
标称供电电压 (Vsup):15 V表面贴装:NO
最长接通时间:250 ns切换:BREAK-BEFORE-MAKE
技术:CMOS温度等级:MILITARY
端子面层:TIN LEAD端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:20Base Number Matches:1

DG307AAK/883B 数据手册

 浏览型号DG307AAK/883B的Datasheet PDF文件第2页浏览型号DG307AAK/883B的Datasheet PDF文件第3页浏览型号DG307AAK/883B的Datasheet PDF文件第4页 
SCOPE: CMOS, TTL-COMPATIBLE ANALOG SWITCHES  
Device Type  
Generic Number  
DG304AA(x)/883B  
DG305AA(x)/883B  
DG306AA(x)/883B  
DG307AA(x)/883B  
01  
02  
03  
04  
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:  
Outline Letter  
Mil-Std-1835  
Case Outline  
Package Code  
A
K
Z
MACY1-X10  
GDIP1-T14 or CDIP2-T14  
CQCC1-N20  
10 Pin TO-100  
14 LEAD CERDIP  
20-Pin Ceramic LCC  
A10  
J14  
L20  
Absolute Maximum Ratings  
V+ to V- ............................................................................................................................. 44V  
V+ to GND ........................................................................................................................ 25V  
Digital Input Overage Range ........................................................................... -2V to (V+ +2V)  
Current, Any terminal except S or D ............................................................................... 30mA  
Continuous Current, S or D ............................................................................................. 30mA  
Peak Current (pulsed at 1ms, 10% duty cycle max) ...................................................... 100mA  
Lead Temperature (soldering, 10 seconds) ........................................................................ +300°C  
Storage Temperature ........................................................................................... -65°C to +150°C  
Continuous Power Dissipation ............................................................................ TA=+70°C  
10 lead Can (derate 6.7mW/°C above +70°C) ......................................................... 533mW  
14 lead CERDIP(derate 9.1mW/°C above +70°C) .................................................. 727mW  
20-Pin LCC (derate 9.1mW/°C above +70°C) ........................................................ 727mW  
Junction Temperature TJ ............................................................................…....... +150°C  
Thermal Resistance, Junction to Case, ΘJC:  
Case Outline TO-100 Can ....................................................................... 45°C/W  
Case Outline 14 lead CERDIP................................................................. 55°C/W  
Case Outline 20-Pin LCC ....................................................................... 20°C/W  
Thermal Resistance, Junction to Ambient, ΘJA:  
Case Outline TO-100 Can .................................................................... 150°C/W  
Case Outline 14 lead CERDIP.............................................................. 110°C/W  
Case Outline 20-Pin LCC .................................................................... 110°C/W  
Recommended Operating Conditions.  
Ambient Operating Range (TA) ........................................................... -55°C to +125°C  
NOTE 1: Signals on SX, DX, or INX exceeding V+ or V- are clamped by internal diodes, and are  
also internally current limited to 25mA.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.  
These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
----------------------------  
Electrical Characteristics of DG304A/DG305/  
DG306/DG307/883B  
19-0058  
Page 2 of  
Rev. B  
6

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