Datasheet > DFLZ5V1_09

DFLZ5V1_09

更新时间： 2024-11-28 10:03:19

品牌	Logo	应用领域
美台 - DIODES		稳压二极管
页数	文件大小	规格书
4页	66K
描述
1.0W SURFACE MOUNT POWER ZENER DIODE

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中文翻译

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数据手册

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DFLZ5V1_09 数据手册

DFLZ5V1 - DFLZ39

1.0W SURFACE MOUNT POWER ZENER DIODE

PowerDI^®123

Features

Mechanical Data

•

1W Power Dissipation on FR-4 PCB

Lead Free Finish, RoHS Compliant (Note 2)

"Green" Molding Compound (No Br, Sb)

•

Case: PowerDI^®123

Case Material: Molded Plastic, “Green” Molding Compound. UL

Flammability Classification Rating 94V-0

•

Moisture Sensitivity: Level 1 per J-STD-020D

Terminal Connections: Cathode Band

Terminals: Finish - Matte Tin annealed over Copper leadframe.

Solderable per MIL-STD-202, Method 208

Qualified to AEC-Q101 Standards for High Reliability

•

Marking Information: See Page 3

Ordering Information: See Page 3

Weight: 0.01 grams (approximate)

Top View

Maximum Ratings @T_A= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

1.2

Forward Voltage

@ I_F= 200mA

V_F

Thermal Characteristics

Characteristic

Symbol

P_D

Typ

—

Value

Unit

Power Dissipation (Note 1)

1.0

Thermal Resistance Junction to Ambient Air (Note 1)

Thermal Resistance Junction to Soldering Point (Note 3)

Operating and Storage Temperature Range

110

—

°C/W

°C

R_θ

—

-55 to +150

T_J, T_STG

Notes:

1. Device mounted on 1" x 1", FR-4 PCB; 2 oz. Cu pad layout as shown on Diodes Inc. suggested pad layout document AP02001.pdf.

2. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.

3. Theoretical R_θJScalculated from the top center of the die straight down to the PCB/cathode tab solder junction.

PowerDI is a registered trademark of Diodes Incorporated.

1 of 4

www.diodes.com

January 2009

DFLZ5V1 - DFLZ39

Document number: DS30464 Rev. 8 - 2

12 3 4

中文翻译

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