Datasheet > DC0019/03-L37-3F-0.25-2A

DC0019/03-L37-3F-0.25-2A

更新时间： 2024-11-15 22:55:43

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
2页	665K
描述
THERM PAD 31.75MMX31.75MM W/ADH

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DC0019/03-L37-3F-0.25-2A 数据手册

L37-3F

Thermal Conductive Pad

Version 1.180418

Thermal Conductive Pad

L37-3F is an ultra thin silicone based thermal interface pad which offers a good

combination of high dielectric breakdown voltage, compliance and low thermal

impedance. It contains a ﬁbreglass mesh for enhanced ease of manufacture and is

available in various formats such as standard sheets, log-rolls and custom die cut

parts. L37-3F is available in a range of thicknesses and with one or two side thermally

conductive adhesive pre-applied.

Features

Made of silicone, thermal conductive particles, ﬁbreglass

Low elongation

Electrical insulation

Easy to assemble

Applications

Electronic components: IC, CPU, MOS

LED, M/B, P/S, Heat Sink

LCD TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.

DDR II Module, DVD Applications, Hand-set applications, etc.

Properties

REACH Compliant

ROHS Compliant

Property

L37-3F

Yellow

Unit

Tolerance

Test Method

Visual

Colour

Thickness

(Available thickness

range)

0.25/0.3/0.45

ASTM D374

0.0098/0.0118/0.0177

inch

ASTM D374

Thermal Conductivity

Flammability Rating

1.4

W/mK

0.14

ASTM D5470

UL 94

V-0

Dielectric Breakdown

Voltage

kV/mm

0.4

ASTM D149

Weight Loss

Density

‹1

ASTM E595

ASTM D792

-40 to 200

›10¹³

g/cm³

˚C

0.2

Working Temperature

Volume Resistance

Elongation

Ohm-cm

ASTM D257

ASTM D412

ASTM D2240

Tensile Strength

Hardness

150

Kgf/cm²

Shore A

Thermal Impedance vs Pressure vs Deﬂection

T-Global Technology Limited

1 & 2 Cosford Business Park, Central Park,

Lutterworth, Leicestershire LE17 4QU U.K.

Tel: +44 (0)1455 553 510

Email: sales@tglobaltechnology.com

Web: www.tglobaltechnology.com

Skype: tglobal.technology

VAT #: GB 116 662 714

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