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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| DBML50P | FCI-CONNECTOR |
获取价格 |
SUB MALE DM HE501 series with solder bucket |
|
| DBML50P043 | FCI-CONNECTOR |
获取价格 |
SUB MALE DM HE501 series with solder bucket |
|
| DBML50S300 | AMPHENOL |
获取价格 |
D Type Connector, 50 Contact(s), Female, 0.109 inch Pitch, Solder Terminal, Locking |
|
| DBML50S300N | AMPHENOL |
获取价格 |
D Subminiature Connector |
|
| DBML50S400 | AMPHENOL |
获取价格 |
D Type Connector, 50 Contact(s), Female, 0.109 inch Pitch, Wire Wrap Terminal, Locking |
|
| DBML50S400N | AMPHENOL |
获取价格 |
D Type Connector, 50 Contact(s), Female, 0.109 inch Pitch, Wire Wrap Terminal, Locking |
|
| DBML50S500 | AMPHENOL |
获取价格 |
D Type Connector, 50 Contact(s), Female, 0.109 inch Pitch, Solder Terminal, Locking |
|
| DBML50S500C | FCI-CONNECTOR |
获取价格 |
SUB FEMALE DM HE501 series with right angle contact |
|
| DBML50S500M | FCI-CONNECTOR |
获取价格 |
SUB FEMALE DM HE501 series with right angle contact |
|
| DBML50S543C | FCI-CONNECTOR |
获取价格 |
SUB FEMALE DM HE501 series with right angle contact |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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