DBF251 THRU DBF2510
2.5A Bridge Rectifiers
Chip Integration Technology Corporation
■ Features
■ Outline
DBF
• Glass passivated die construction
• Low leakage
.047 (1.2)
.031 (0.8)
• High current capability
• Ideal for printed circuit board
-
• Design for surface mount application
• Suffix “G” indicates Halogen free parts, ex DBF251G
• Plastic Material-UL Flammability 94V-0
+
■ Mechanical data
.205 (5.2)
.189 (4.8)
.270 (6.85)
.254 (6.45)
.165 (4.2)
.149 (3.8)
• Case : DBF,Molded plastic.
• Terminals :plated leads solderable per
MIL-STD-202, Method 208.
• Polarity : as marked on case.
• Mounting position: Any.
• Marking: type number.
■ Circuit Diagram
■ Maximum ratings and electrical characteristics
■ Dimensions in inches and (millimeters)
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz,resistive or inductive load.
For capacitive load, derate current by 20%
Parameter
Conditions
TC = 100OC (Note:1)
Symbol
IF(AV)
I2t
Value
2.5
UNIT
A
A2s
Average rectified output current
Rating for fusing (t<8.3ms)
59.76
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
TA = 25OC
TA = 125OC
Non-Repetitive Peak
Forward surge current
IFSM
120
A
Peak Reverse current
at rated DC blocking voltage
5
IR
uA
200
70
15
Typical Thermal resistance
per leg
RθJA
RθJC
OC/W
Typical Junction Capacitance
per leg(Note 2)
CJ
41
pF
OC
Operating and Storage
temperature Range
TJ, TSTG
-55 to
+150
forward voltage
Max.
Max.
Max. DC
blocking voltage
VDC (V)
Max.
RMS voltage
VRMS (V)
per element
@IF=2.5A
VFM (V)
repetitive peak Working peak
reverse voltage reverse voltage
Symbol
VRRM (V)
VRWM (V)
DBF251
DBF252
DBF254
DBF256
DBF258
DBF2510
100
200
400
600
800
1000
100
200
400
600
800
1000
100
200
400
600
800
1000
70
140
280
420
560
700
1.0
Note: 1.Mounted on glass epoxy PC board with 1.3mm2 solder pad.
Note: 2.Measured at 1.0 MHZ and applied reverse voltage of 4.0V DC.
Document ID : DS-22B49
Revised Date : 2016/09/13
Revision : C
1