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DAC102S085CIMMX PDF预览

DAC102S085CIMMX

更新时间： 2024-02-25 00:07:08
品牌 Logo 应用领域
德州仪器 - TI 转换器数模转换器光电二极管
页数 文件大小 规格书
28页 1135K
描述
DAC102S085 10-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail

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DAC102S085CIMMX 技术参数

是否无铅： 含铅是否Rohs认证： 不符合
生命周期：Obsolete零件包装代码：SON
包装说明：LLP-10针数：10
Reach Compliance Code：not_compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.14
Is Samacsys：N最大模拟输出电压：5.5 V
最小模拟输出电压：转换器类型：D/A CONVERTER
输入位码：BINARY输入格式：SERIAL
JESD-30 代码：S-PDSO-N10JESD-609代码：e0
长度：3 mm最大线性误差 (EL)：0.1953%
湿度敏感等级：1位数：10
功能数量：1端子数量：10
最高工作温度：105 °C最低工作温度：-40 °C
封装主体材料：PLASTIC/EPOXY封装代码：HVSON
封装等效代码：SOLCC10,.11,20封装形状：SQUARE
封装形式：SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度（摄氏度）：260
电源：3/5 V认证状态：Not Qualified
座面最大高度：0.8 mm最大稳定时间：6 µs
标称安定时间 (tstl)：4.5 µs子类别：Other Converters
最大压摆率：0.41 mA标称供电电压：3 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：Tin/Lead (Sn/Pb)
端子形式：NO LEAD端子节距：0.5 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：3 mmBase Number Matches：1

DAC102S085CIMMX 数据手册

 浏览型号DAC102S085CIMMX的Datasheet PDF文件第19页浏览型号DAC102S085CIMMX的Datasheet PDF文件第20页浏览型号DAC102S085CIMMX的Datasheet PDF文件第21页浏览型号DAC102S085CIMMX的Datasheet PDF文件第23页浏览型号DAC102S085CIMMX的Datasheet PDF文件第24页浏览型号DAC102S085CIMMX的Datasheet PDF文件第25页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Nov-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
1000  
1000  
(1)  
(2)  
(6)  
(3)  
(4/5)  
DAC102S085CIMM  
NRND  
ACTIVE  
VSSOP  
VSSOP  
DGS  
10  
10  
TBD  
Call TI  
CU SN  
Call TI  
-40 to 105  
-40 to 105  
X74C  
X74C  
DAC102S085CIMM/NOPB  
DGS  
Green (RoHS  
& no Sb/Br)  
Level-1-260C-UNLIM  
DAC102S085CIMMX/NOPB  
DAC102S085CISD/NOPB  
DAC102S085CISDX/NOPB  
ACTIVE  
ACTIVE  
ACTIVE  
VSSOP  
WSON  
WSON  
DGS  
DSC  
DSC  
10  
10  
10  
3500  
1000  
4500  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
CU SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 105  
-40 to 105  
-40 to 105  
X74C  
X75C  
X75C  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Addendum-Page 1  
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与DAC102S085CIMMX相关器件

型号 品牌 描述 获取价格 数据表
DAC102S085CIMMX/NOPB TI 具有轨到轨输出的 10 位微功耗双路数模转换器 | DGS | 10 | -40 to 1

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DAC102S085CISD TI DAC102S085 10-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail

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DAC102S085CISD NSC 10-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail Output

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DAC102S085CISD/NOPB TI 具有轨到轨输出的 10 位微功耗双路数模转换器 | DSC | 10 | -40 to 1

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DAC102S085CISDX TI DAC102S085 10-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail

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DAC102S085CISDX NSC 10-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail Output

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