1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
E
F
2
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CQCC1-N20
16
16
20
Dual-in-line
Flat pack
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage (V+ to V-) .......................................................................................... 36 V dc
Logic inputs ............................................................................................................... V- to (V- plus 36 V dc)
Logic control voltage (V ) ........................................................................................ V- to V+
LC
Analog current outputs (at V- = 15 V) ........................................................................ 4.25 mA
Reference input (V
REF+
to V
) ............................................................................ V- to V+
to V ) .............................................. ±18 V dc
REF-
Reference input differential voltage (V
REF+
REF-
Reference input current (I
Power dissipation (P ):
) .............................................................................. 5.0 mA
VREF+
D
Cases E, F, and 2 .................................................................................................. 500 mW
Maximum junction temperature (T ) .......................................................................... +150°C
J
Lead temperature (soldering, 60 seconds) ................................................................ +300°C
Storage temperature .................................................................................................. -65°C to +125°C
Thermal resistance, junction-to-case (θ ) ................................................................ See MIL-STD-1835
JC
Thermal resistance, junction-to-ambient (θ ):
JA
Case E ................................................................................................................... 91°C/W
Case F ................................................................................................................... 120°C/W
Case 2 …………………………………………………………………………………….. 110°C/W
1.4 Recommended operating conditions.
Supply voltage (V ) .................................................................................................. ±15 V dc
S
Input reference current (I
REF
) ................................................................................... 2.0 mA
Ambient operating temperature range (T ) ............................................................... -55°C to +125°C
A
1.5 Radiation features:
Device types 01 and 02:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ............. 100 krads(Si) 2/
Device type 03:
Maximum total dose available (dose rate ≤ 10 mrads(Si)/s) .................... 50 krads(Si) 3/
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Device types 01 and 02 may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate
effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in
MIL-STD-883, method 1019, condition A.
3/ For device type 03, radiation end point limits for the noted parameters are guaranteed only for the conditions specified in
MIL-STD-883, method 1019, condition D.
SIZE
STANDARD
5962-89932
A
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
REVISION LEVEL
G
SHEET
COLUMBUS, OHIO 43218-3990
3
DSCC FORM 2234
APR 97