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D372

更新时间： 2024-11-15 22:29:07

品牌	Logo	应用领域
杰尔 - AGERE		/
页数	文件大小	规格书
8页	60K
描述
D372-Type Digital Uncooled DFB Laser Module for 2.5 Gbits/s Applications

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Data Sheet

December 2000

D372-Type Digital Uncooled DFB

Laser Module for 2.5 Gbits/s Applications

Applications

■ SONET OC-48/STM-16 systems

■ Telecommunications

■ Secure digital data systems

Beneﬁts

■ Easily board mounted

■ Gull wing leads

The low-proﬁle D372-Type Laser Module is ideally suited for

OC-48 SONET and other high-speed digital applications.

■ No additional heat sinks required

■ Low-cost alternative to industry-standard, 14-pin

isolated laser module (ILM)

Features

■ Highly efﬁcient DFB-MQW laser structure allows

for lower threshold and drive currents, and reduced

power consumption

■ 8-pin package suitable for SONET applications

■ Narrow linewidth, distributed feedback, multiquan-

tum-well (DFB-MQW)1.3 µm laser with single-

mode ﬁber pigtail

Description

■ Choice of wide operating temperature ranges:

–40 °C to +85 °C or 0 °C to +85 °C

The D372-type uncooled laser module consists of a

laser diode coupled to a single-mode ﬁber pigtail.

The device is available in a standard, 8-pin conﬁgu-

ration (see Figure 1 and/or Table 1) and is ideal for

long-reach (SONET) and other high-speed digital

applications.

■ No TEC required

■ High output power: typical 2.0 mW peak power

coupled into single-mode ﬁber

■ Hermetically sealed active components

■ Internal back-facet monitor

■ Built-in thermistor and bias T

■ 25 Ω input impedance

The module includes a narrow linewidth (<1 nm),

DFB-MQW single-mode laser and an InGaAs PIN

photodiode back-facet monitor in a hermetically

sealed package.

This package is optimized for a 25 Ω input imped-

ance and allows for dc biasing through an internal

bias T. A thermistor has been included for feedback

to board-level bias circuitry, if needed.

■ Internal isolator

■ Qualiﬁcation program: Telcordia Technologies*

TA-983

* Telcordia Technologies is a registered trademark of Telcordia

Technologies, Inc.

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