CY7C404-25LMBT

更新时间： 2024-01-12 14:25:17

品牌	Logo	应用领域
赛普拉斯 - CYPRESS		先进先出芯片
页数	文件大小	规格书
13页	273K
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数据手册

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CY7C404-25LMBT 数据手册

CY7C401/CY7C403

CY7C402/CY7C404

Package Diagrams (continued)

16-Lead (300-Mil) Molded DIP P1

18-Lead (300-Mil) Molded DIP P3

of anycircuitry other than circuitry embodied in a CypressSemiconductor product. Nor does it conveyor imply any license under patent or other rights. CypressSemiconductor does not authorize

its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress

Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.

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