PRELIMINARY
CY7C199B
32K x 8 Static RAM
is provided by an active LOW Chip Enable (CE) and active
LOW Output Enable (OE) and three-state drivers. This device
has an automatic power-down feature, reducing the power
consumption by 81% when deselected. The CY7C199B is in
the standard 300-mil-wide DIP, SOJ, and LCC packages.
Features
• High speed
— 10 ns
• Fast t
DOE
An active LOW Write Enable signal (WE) controls the writ-
ing/reading operation of the memory. When CE and WE inputs
• CMOS for optimum speed/power
• Low active power
are both LOW, data on the eight data input/output pins (I/O
0
— 495 mW (max, 10 ns “L” version)
• Low standby power
through I/O ) is written into the memory location addressed by
7
the address present on the address pins (A through A ).
0
14
Reading the device is accomplished by selecting the device
and enabling the outputs, CE and OE active LOW, while WE
remains inactive or HIGH. Under these conditions, the con-
tents of the location addressed by the information on address
pins are present on the eight data input/output pins.
— 0.275 mW (max, “L” version)
• 2V data retention (“L” version only)
• Easy memory expansion with CE and OE features
• TTL-compatible inputs and outputs
• Automatic power-down when deselected
The input/output pins remain in a high-impedance state unless
the chip is selected, outputs are enabled, and Write Enable
(WE) is HIGH. A die coat is used to improve alpha immunity.
Functional Description
The CY7C199B is a high-performance CMOS static RAM or-
ganized as 32,768 words by 8 bits. Easy memory expansion
Logic Block Diagram
Pin Configurations
DIP / SOJ / SOIC
Top View
LCC
Top View
A
A
V
CC
28
27
26
5
1
2
3
4
5
6
WE
6
3
2 1 2827
26
A
A
A
4
7
4
A
4
A
8
8
A
3
25
24
5
6
7
8
25
24
23
22
21
20
19
18
A
A
9
3
A
9
A
2
A
A
10
11
12
2
A
10
A
11
23
22
A
1
A
A
A
A
A
1
OE
7
OE
9
13
14
I/O
I/O
I/O
I/O
I/O
I/O
I/O
A
A
A
I/O
I/O
I/O
A
21
20
19
18
17
16
15
12
13
14
A
0
0
1
2
3
4
5
6
0
8
9
10
11
12
13
10
11
12
CE
I/O
I/O
INPUT BUFFER
CE
I/O
I/O
I/O
I/O
I/O
0
7
6
7
1
A
0
0
1
2
6
5
4
1314151617
A
1
C199–3
A
2
I/O
I/O
A
3
GND
14
3
A
4
C199B–2
1024 x 32 x 8
ARRAY
A
5
22
OE
A
A
A
0
21
6
23
24
1
A
20
CE
I/O
I/O
6
I/O
I/O
I/O
GND
7
A
A
A
A
2
3
4
19
18
17
16
8
A
7
25
26
27
28
1
9
5
TSOP I
Top View
(not to scale)
WE
4
3
CE
V
CC
A
A
15
14
13
POWER
DOWN
WE
COLUMN
DECODER
5
6
7
2
3
I/O
2
A
A
A
I/O
7
12
11
I/O
I/O
A
1
0
OE
4
5
8
9
C199B–1
10
9
14
A
6
7
10
A
A
13
12
A
11
8
C199–4
Selection Guide
199B-8
199B-10
10
199B-12
12
199B-15
15
199B-20
20
199B-25
25
199B-35
35
199B-45
45
Maximum Access Time (ns)
Maximum Operating
8
120
110
160
90
155
90
150
90
150
80
140
70
140
Current (mA)
L
90
Maximum CMOS
0.5
0.5
10
10
10
10
10
10
Standby Current (mA)
L
0.05
0.05
0.05
0.05
0.05
0.05
Shaded area contains advance information.
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
•
CA 95134
•
408-943-2600
June 13, 2000