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CY7C1565KV18-400BZXI PDF预览

CY7C1565KV18-400BZXI

更新时间: 2024-11-20 15:18:19
品牌 Logo 应用领域
英飞凌 - INFINEON 静态存储器
页数 文件大小 规格书
30页 760K
描述
Synchronous SRAM

CY7C1565KV18-400BZXI 数据手册

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CY7C1565KV18  
72-Mbit QDR® II+ SRAM Four-Word  
Burst Architecture (2.5 Cycle Read Latency)  
72-QDR® II+ SRAM Four-Word Burst Architecture (2.5 Cycle Read Latency)  
Features  
Configurations  
Separate independent read and write data ports  
Supports concurrent transactions  
With Read Cycle Latency of 2.5 cycles  
CY7C1565KV18: 2M × 36  
550-MHz clock for high bandwidth  
Functional Description  
Four-word burst for reducing address bus frequency  
The CY7C1565KV18 is1.8-V synchronous pipelined SRAM,  
equipped with QDR II+ architecture. Similar to QDR II  
architecture, QDR II+ architecture consists of two separate ports:  
the read port and the write port to access the memory array. The  
read port has dedicated data outputs to support read operations  
and the write port has dedicated data inputs to support write  
operations. QDR II+ architecture has separate data inputs and  
data outputs to completely eliminate the need to “turnaround” the  
data bus that exists with common I/O devices. Each port is  
accessed through a common address bus. Addresses for read  
and write addresses are latched on alternate rising edges of the  
input (K) clock. Accesses to the QDR II+ read and write ports are  
completely independent of one another. To maximize data  
throughput, both read and write ports are equipped with DDR  
interfaces. Each address location is associated with four 36-bit  
words (CY7C1565KV18) that burst sequentially into or out of the  
device. Because data is transferred into and out of the device on  
every rising edge of both input clocks (K and K), memory  
bandwidth is maximized while simplifying system design by  
eliminating bus “turnarounds”.  
Double data rate (DDR) Interfaces on both read and write ports  
(data transferred at 1100 MHz) at 550 MHz  
Available in 2.5-clock cycle latency  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
Single multiplexed address input bus latches address inputs  
for read and write ports  
Separate port selects for depth expansion  
Synchronous internally self-timed writes  
Quaddatarate(QDR®)II+operateswith2.5-cyclereadlatency  
when DOFF is asserted HIGH  
Operates similar to QDR I device with one cycle read latency  
when DOFF is asserted LOW  
Depth expansion is accomplished with port selects, which  
enables each port to operate independently.  
Available in × 36 configurations  
Full data coherency, providing most current data  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
[1]  
Core VDD = 1.8 V± 0.1 V; I/O VDDQ = 1.4 V to VDD  
Supports both 1.5 V and 1.8 V I/O supply  
High-speed transceiver logic (HSTL) inputs and variable drive  
HSTL output buffers  
For a complete list of related documentation, click here.  
Available in 165-ball fine pitch ball grid array (FBGA) package  
(13 ×15 ×1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible test access port  
Phase-locked loop (PLL) for accurate data placement  
Selection Guide  
Description  
550 MHz  
550  
500 MHz  
500  
450 MHz  
450  
400 MHz Unit  
Maximum operating frequency  
Maximum operating current  
400  
MHz  
mA  
× 36  
1310  
1210  
1100  
1000  
Note  
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V  
= 1.4 V to V  
.
DD  
DDQ  
Cypress Semiconductor Corporation  
Document Number: 001-15878 Rev. *S  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised November 30, 2017  

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