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CY7C1518KV18-250BZI PDF预览

CY7C1518KV18-250BZI

更新时间: 2024-11-25 11:10:43
品牌 Logo 应用领域
英飞凌 - INFINEON 时钟双倍数据速率静态存储器内存集成电路
页数 文件大小 规格书
32页 790K
描述
DDR-II CIO

CY7C1518KV18-250BZI 数据手册

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CY7C1518KV18  
CY7C1520KV18  
72-Mbit DDR-II SRAM Two-Word  
Burst Architecture  
72-Mbit DDR-II SRAM Two-Word Burst Architecture  
Features  
Configurations  
72-Mbit density (4M × 18, 2M × 36)  
CY7C1518KV18 – 4M × 18  
CY7C1520KV18 – 2M × 36  
333 MHz clock for high bandwidth  
Two-word burst for reducing address bus frequency  
Functional Description  
Double data rate (DDR) interfaces (data transferred at  
666 MHz) at 333 MHz  
The CY7C1518KV18, and CY7C1520KV18 are 1.8 V  
synchronous pipelined SRAM equipped with DDR II architecture.  
The DDR II consists of an SRAM core with advanced  
synchronous peripheral circuitry and a 1-bit burst counter.  
Addresses for read and write are latched on alternate rising  
edges of the input (K) clock. Write data is registered on the rising  
edges of both K and K. Read data is driven on the rising edges  
of C and C if provided, or on the rising edge of K and K if C/C are  
not provided. On CY7C1518KV18 and CY7C1520KV18, the  
burst counter takes in the least significant bit of the external  
address and bursts two 18-bit words in the case of  
CY7C1518KV18 and two 36-bit words in the case of  
CY7C1520KV18 sequentially into or out of the device.  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Two input clocks for output data (C and C) to minimize clock  
skew and flight time mismatches  
Echo clocks (CQ and CQ) simplify data capture in high speed  
systems  
Synchronous internally self-timed writes  
DDR II operates with 1.5 cycle read latency when DOFF is  
asserted HIGH  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs (Q, sharing the same  
physical pins as the data inputs D) are tightly matched to the two  
output echo clocks CQ/CQ, eliminating the need for separately  
capturing data from each individual DDR SRAM in the system  
design. Output data clocks (C/C) enable maximum system  
clocking and data synchronization flexibility.  
Operates similar to DDR-I device with 1 cycle read latency  
when DOFF is asserted LOW  
1.8 V core power supply with HSTL inputs and outputs  
Variable drive HSTL output buffers  
Expanded HSTL output voltage (1.4 V–VDD  
)
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the C or C (or K or K in a single clock  
domain) input clocks. Writes are conducted with on-chip  
synchronous self-timed write circuitry.  
Supports both 1.5 V and 1.8 V IO supply  
Available in 165-ball fine pitch ball grid array (FBGA) package  
(13 × 15 × 1.4 mm)  
Offered in both Pb-free and non Pb-free packages  
JTAG 1149.1 compatible Test Access Port  
For a complete list of related documentation, click here.  
Phase-locked loop (PLL) for accurate data placement  
Selection Guide  
Description  
Maximum Operating Frequency  
333 MHz  
333  
300 MHz  
300  
250 MHz Unit  
250  
430  
530  
MHz  
mA  
Maximum Operating Current  
× 18  
× 36  
520  
490  
640  
600  
Cypress Semiconductor Corporation  
Document Number: 001-00437 Rev. *V  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised December 6, 2017  

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