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CY7C1359A-133AC PDF预览

CY7C1359A-133AC

更新时间: 2024-01-23 00:38:48
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 存储内存集成电路静态存储器
页数 文件大小 规格书
24页 234K
描述
256K x 18 Synchronous-Pipelined Cache Tag RAM

CY7C1359A-133AC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:LQFP, QFP100,.63X.87
针数:100Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.88最长访问时间:4 ns
其他特性:PIPELINED ARCHITECTUREJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:4718592 bit内存集成电路类型:CACHE TAG SRAM
内存宽度:18功能数量:1
端子数量:100字数:262144 words
字数代码:256000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:256KX18封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装等效代码:QFP100,.63X.87
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V认证状态:Not Qualified
座面最大高度:1.6 mm最大待机电流:0.06 A
子类别:SRAMs最大压摆率:0.25 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

CY7C1359A-133AC 数据手册

 浏览型号CY7C1359A-133AC的Datasheet PDF文件第2页浏览型号CY7C1359A-133AC的Datasheet PDF文件第3页浏览型号CY7C1359A-133AC的Datasheet PDF文件第4页浏览型号CY7C1359A-133AC的Datasheet PDF文件第5页浏览型号CY7C1359A-133AC的Datasheet PDF文件第6页浏览型号CY7C1359A-133AC的Datasheet PDF文件第7页 
327  
CY7C1359A/GVT71256T18  
256K x 18 Synchronous-Pipelined Cache Tag RAM  
All synchronous inputs are gated by registers controlled by a  
positive-edge-triggered Clock Input (CLK). The synchronous  
Features  
• Fast match times: 3.5, 3.8, 4.0 and 4.5 ns  
• Fast clock speed: 166, 150, 133, and 100 MHz  
• Fast OE access times: 3.5, 3.8, 4.0 and 5.0 ns  
• Pipelined data comparator  
• Data input register load control by DEN  
• Optimal for depth expansion (one cycle chip deselect  
to eliminate bus contention)  
• 3.3V –5% and +10% core power supply  
• 2.5V or 3.3V I/O supply  
• 5V tolerant inputs except I/Os  
• Clamp diodes to VSS at all inputs and outputs  
• Common data inputs and data outputs  
• JTAG boundary scan  
inputs include all addresses, all data inputs, address-pipelin-  
ing Chip Enable (CE), depth-expansion Chip Enables (CE2  
and CE2), Burst Control Inputs (ADSC, ADSP, and ADV), Write  
Enables (WEL, WEH, and BWE), Global Write (GW), and Data  
Input Enable (DEN).  
Asynchronous inputs include the Burst Mode Control (MODE),  
the Output Enable (OE) and the Match Output Enable (MOE).  
The data outputs (Q) and Match Output (MATCH), enabled by  
OE and MOE respectively, are also asynchronous.  
Addresses and chip enables are registered with either Ad-  
dress Status Processor (ADSP) or Address status Controller  
(ADSC) input pins. Subsequent burst addresses can be inter-  
nally generated as controlled by the Burst Advance pin (ADV).  
Data inputs are registered with Data Input Enable (DEN) and  
chip enable pins (CE, CE2, and CE2). The outputs of the data  
input registers are compared with data in the memory array  
and a match signal is generated. The match output is gated  
into a pipeline register and released to the match output pin at  
the next rising edge of Clock (CLK).  
• Byte Write Enable and Global Write control  
• Three chip enables for depth expansion and address  
pipeline  
• Address, data, and control registers  
• Internally self-timed Write Cycle  
Address, data inputs, and write controls are registered on-chip  
to initiate self-timed WRITE cycle. WRITE cycles can be one  
to two bytes wide as controlled by the write control inputs. In-  
dividual byte write allows individual byte to be written. WEL  
controls DQ1DQ9. WEH controls DQ10DQ18. WEL and  
WEH can be active only with BWE being LOW. GW being LOW  
causes all bytes to be written.  
• Burst control pins (interleaved or linear burst se-  
quence)  
• Automatic power-down for portable applications  
• Low-profile JEDEC standard 100-pin TQFP package  
Functional Description  
The Cypress Synchronous Burst SRAM family employs  
high-speed, low power CMOS designs using advanced tri-  
ple-layer polysilicon, double-layer metal technology. Each  
memory cell consists of four transistors and two high valued  
resistors.  
The CY7C1359C/GVT71256T18 operates from a +3.3V pow-  
er supply with output power supply being +2.5V or +3.3V. All  
inputs and outputs are LVTTL compatible. The device is ideally  
suited for address tag RAM for up to 8 MB secondary cache.  
Selection Guide  
7C1359A-166  
71256T36-6  
7C1359A-150  
71256T36-6.7  
7C1359A-133  
71256T36-7.5  
7C1359A-100  
71256T36-10  
Maximum Access Time (ns)  
3.5  
310  
20  
3.8  
275  
20  
4.0  
250  
20  
4.5  
190  
20  
Maximum Operating Current (mA)  
Maximum CMOS Standby Current (mA)  
Cypress Semiconductor Corporation  
Document #: 38-05120 Rev. **  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Revised September 13, 2001  

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