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CY7C1356V25-166AC PDF预览

CY7C1356V25-166AC

更新时间: 2024-11-20 05:46:07
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
27页 722K
描述
ZBT SRAM, 512KX18, 3.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

CY7C1356V25-166AC 数据手册

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356V25  
CY7C1354V25  
CY7C1356V25  
PRELIMINARY  
256Kx36/512Kx18 Pipelined SRAM with NoBL™ Architecture  
spectively. They are designed specifically to support unlimited  
Features  
true back-to-back Read/Write operations without the insertion  
of wait states. The CY7C1354V25/CY7C1356V25 is equipped  
with the advanced No Bus Latency(NoBL) logic required  
to enable consecutive Read/Write operations with data being  
transferred on every clock cycle. This feature dramatically im-  
proves the throughput of data through the SRAM, especially in  
systems that require frequent Write/Read transitions. The  
CY7C1354V25/CY7C1356V25 is pin compatible and function-  
ally equivalent to ZBT devices.  
Pin compatible and functionally equivalent to ZBT™  
• Supports 200-MHz bus operations with zero wait states  
— Data is transferred on every clock  
• Internally self-timed output buffer control to eliminate  
the need to use asynchronous OE  
• Fully Registered (inputs and outputs) for pipelined op-  
eration  
• Byte Write capability  
All synchronous inputs pass through input registers controlled  
by the rising edge of the clock. All data outputs pass through  
output registers controlled by the rising edge of the clock. The  
clock input is qualified by the Clock Enable (CEN) signal, which  
when deasserted suspends operation and extends the previ-  
ous clock cycle. Maximum access delay from the clock rise is  
3.2 ns (200-MHz device).  
• Common I/O architecture  
• Single 2.5V power supply  
• Fast clock-to-output times  
— 3.2 ns (for 200-MHz device)  
— 3.5 ns (for 166-MHz device)  
— 4.2 ns (for 133-MHz device)  
Write operations are controlled by the Byte Write Selects  
(BWSaBWSd for CY7C1354V25 and BWSaBWSb for  
CY7C1356V25) and a Write Enable (WE) input. All writes are  
conducted with on-chip synchronous self-timed write circuitry.  
— 5.0 ns (for 100-MHz device)  
• Clock Enable (CEN) pin to suspend operation  
• Synchronous self-timed writes  
• Available in 100 TQFP & 119 BGA Packages  
• Burst Capability—linear or interleaved burst order  
Three synchronous Chip Enables (CE1, CE2, CE3) and an  
asynchronous Output Enable (OE) provide for easy bank se-  
lection and output three-state control. In order to avoid bus  
contention, the output drivers are synchronously three-stated  
during the data portion of a write sequence.  
Functional Description  
The CY7C1354V25 and CY7C1356V25 are 2.5V, 256K by 36  
and 512K by 18 Synchronous-Pipelined Burst SRAMs, re-  
Logic Block Diagram  
D
CLK  
Data-In REG.  
CE  
Q
ADV/LD  
A
x
CEN  
CE  
CONTROL  
and WRITE  
LOGIC  
256KX36/  
512KX18  
MEMORY  
ARRAY  
1
CE  
CE  
2
DQ  
x
3
WE  
DP  
x
CY7C1354 CY7C1356  
X = 17:0 X = 18:0  
BWS  
x
A
X
Mode  
X = a, b, c, d X = a, b  
DQ  
X
X = a, b, c, d X = a, b  
X = a, b, c, d X = a, b  
DP  
X
BWS  
X
OE  
.
Selection Guide  
7C1354V25-200 7C1354V25-166 7C1354V25-133 7C1354V25-100  
7C1356V25-200 7C1356V25-166 7C1356V25-133 7C1356V25-100  
Maximum Access Time (ns)  
3.2  
475  
10  
3.5  
450  
10  
4.0  
370  
10  
5.0  
300  
10  
Maximum Operating Current (mA)  
Coml  
Maximum CMOS Standby Current (mA) Coml  
Shaded areas contain advance information.  
No Bus Latency and NoBL are trademarks of Cypress Semiconductor Corporation.  
ZBT is a trademark of Integrated Device Technology.  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05263 Rev. **  
Revised March 6, 2002  

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