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CY74FCT162500TTSSOP PDF预览

CY74FCT162500TTSSOP

更新时间： 2024-01-02 16:51:31
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
6页 66K
描述
18-Bit Registered Transceivers

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CY74FCT162500TTSSOP 技术参数

生命周期：Transferred零件包装代码：SSOP
包装说明：SSOP,针数：56
Reach Compliance Code：unknown风险等级：5.2
其他特性：WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION系列：FCT
JESD-30 代码：R-PDSO-G56长度：18.415 mm
负载电容（CL）：50 pF逻辑集成电路类型：REGISTERED BUS TRANSCEIVER
位数：18功能数量：1
端口数量：2端子数量：56
最高工作温度：85 °C最低工作温度：-40 °C
输出特性：3-STATE WITH SERIES RESISTOR输出极性：TRUE
封装主体材料：PLASTIC/EPOXY封装代码：SSOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, SHRINK PITCH
传播延迟（tpd）：5.3 ns认证状态：Not Qualified
座面最大高度：2.794 mm最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：4.5 V标称供电电压 (Vsup)：5 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：GULL WING
端子节距：0.635 mm端子位置：DUAL
宽度：7.5 mmBase Number Matches：1

CY74FCT162500TTSSOP 数据手册

 浏览型号CY74FCT162500TTSSOP的Datasheet PDF文件第1页浏览型号CY74FCT162500TTSSOP的Datasheet PDF文件第3页浏览型号CY74FCT162500TTSSOP的Datasheet PDF文件第4页浏览型号CY74FCT162500TTSSOP的Datasheet PDF文件第5页浏览型号CY74FCT162500TTSSOP的Datasheet PDF文件第6页 
CY74FCT16500T  
CY74FCT162500T  
Maximum Ratings[5, 6]  
Pin Summary  
(Above which the useful life may be impaired. For user  
guidelines, not tested.)  
Name  
Description  
OEAB  
OEBA  
LEAB  
LEBA  
CLKAB  
CLKBA  
A
A-to-B Output Enable Input  
Storage Temperature .......................Com’l −55°C to +125°C  
B-to-A Output Enable Input (Active LOW)  
A-to-B Latch Enable Input  
Ambient Temperature with  
Power Applied................................... Com’l −55°C to +125°C  
B-to-A Latch Enable Input  
DC Input Voltage .................................................−0.5V to +7.0V  
DC Output Voltage ..............................................−0.5V to +7.0V  
A-to-B Clock Input (Active LOW)  
DC Output Current  
(Maximum Sink Current/Pin) ...........................−60 to +120 mA  
B-to-A Clock Input (Active LOW)  
A-to-B Data Inputs or B-to-A Three-State Outputs  
B-to-A Data Inputs or A-to-B Three-State Outputs  
Power Dissipation..........................................................1.0W  
B
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
Function Table[1, 2]  
Operating Range  
Inputs  
Outputs  
OEAB  
LEAB  
CLKAB  
A
X
L
B
Z
Ambient  
Range  
Industrial  
Temperature  
VCC  
L
X
H
H
L
X
X
X
−40°C to +85°C  
5V ± 10%  
H
H
H
H
H
H
L
H
L
H
L
L
H
X
X
H
L
H
L
B[3]  
B[4]  
L
Electrical Characteristics Over the Operating Range  
Parameter  
Description  
Input HIGH Voltage  
Test Conditions  
Min.  
Typ.[7]  
Max.  
Unit  
VIH  
VIL  
VH  
VIK  
IIH  
2.0  
V
V
Input LOW Voltage  
Input Hysteresis[8]  
0.8  
100  
mV  
V
Input Clamp Diode Voltage  
Input HIGH Current  
Input LOW Current  
VCC=Min., IIN=−18 mA  
VCC=Max., VI=VCC  
−0.7  
−1.2  
±1  
µA  
µA  
µA  
IIL  
VCC=Max., VI=GND.  
VCC=Max., VOUT=2.7V  
±1  
IOZH  
High Impedance Output Current  
(Three-State Output pins)  
±1  
IOZL  
High Impedance Output Current  
(Three-State Output pins)  
VCC=Max., VOUT=0.5V  
±1  
µA  
IOS  
IO  
Short Circuit Current[9]  
Output Drive Current[9]  
Power-Off Disable  
VCC=Max., VOUT=GND  
VCC=Max., VOUT=2.5V  
VCC=0V, VOUT≤4.5V[10]  
−80  
−50  
−140  
−200  
−180  
±1  
mA  
mA  
µA  
IOFF  
Notes:  
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = HIGH Impedance.  
2. A-to-B data flow is shown, B-to-A data flow is similar but uses OEBA, LEBA, and CLKBA.  
3. Output level before the indicated steady-state input conditions were established.  
= HIGH-to-LOW Transition.  
4. Output level before the indicated steady-state input conditions were established, provided that CLKAB was LOW before LEAB went LOW.  
5. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature  
range.  
6. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
7. Typical values are at VCC= 5.0V, TA= +25˚C ambient.  
8. This parameter is specified but not tested.  
9. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of  
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
10. Tested at +25˚C.  
2
123456

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