11. Reliability and Test Condition
Items
Requirements
Test Methods and Remarks
No removal or split of the termination or
other defects shall occur.
1. Solder the inductor to the testing jig (glass epoxy
board shown in Fing.7.1-1) using eutectic solder.
Then apply a force in the direction of the arrow.
2. 10N force.
Terminal
Strength
3. Keep time: 5±2s
1. Storage Temperature :125+/-5℃
2. Duration: 96 ±4 Hours
High
1. No visible mechanical damage.
2. Inductance change: Within ±10%
Temperature
3. Recovery: then measured at room ambient
temperature after placing 24 hours.
1. Temperature and time: -40±5℃
2. Duration: 96±4 hours
Low
1. No visible mechanical damage.
2. Inductance change: Within ±10%
Temperature
3. TRecovery: then measured at room ambient
temperature after placing 24 hours.
1. Frequency range:10HZ~55HZ~10HZ
2. Amplitude:1.5mm p-p
1. No visible mechanical damage.
2. Inductance change: Within ±10%
Vibration test
3. Direction: X, Y, Z
4. Time:1 minute/cycle,2hours per axis
1. Storage Temperature: 60+/-2℃
2. Relative Humidity: 90-95% RH
3. Duration : 96 ±4 Hours
High
Temperature
Storage
Tested
1. No visible mechanical damage.
2. Inductance change: Within ±10%
4. Recovery: then measured at room ambient
temperature after placing 24 hours.
1. No visible mechanical damage.
2. Inductance change: Within ±10%
1. Temperature and time: -40±3℃ for 30±3 min→105
℃ for 30±3min, please refer to Fig.7.7-1.
Thermal
Shock
2. Transforming interval: Max, 3 minute
3. Tested cycle: 100 cycles
4. The chip shall be stabilized at normal condition for
1~2 hours before measuring
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