10. Reliability and Test Condition
Reliability Experiment For Electrical
Test Item
Accept criteria
Test Condition
Standard Source
1.Change from an initial
value L:within±5%
2.no visible damage.
1.Change from an initial
value L:within±5%
2.no visible damage.
1.Change from an initial
value L:within±5%
MIL-STD-202H
Method 103
Test Condition B
+40℃± 2℃, humidity of 90% ±5% (total 96
hours).
Humidity Test
High Temperature
Test
IEC 68-2
Test Condition B
1.Temperature: +125℃±2℃.
2.Test time: 72±2hrs.
Low Temperature
Test
IEC 68-2
Test Condition A
1.Temperature: -25℃±2℃.
2.Test time: 72±2hrs.
2.no visible damage.
Reference
1.Change from an initial
value L:within±5%
2.no visible damage.
MIL-STD-202H
Method 107
Test Condition
B-2
+125℃±5℃ (30 minutes) ~ -65±5℃ (30
minutes), temperature switch time: 5
minutes (total 50 cycles).
Thermal Shock
Life Test
Reference
1.Change from an initial
value L:within±5%
2.no visible damage.
MIL-STD-202H
Method 108
Test Condition B
+70℃±5℃ (250Hours).
Reliability Experiment For Physical
Test Item
Accept criteria
Test Condition
Standard Source
1.Change from an initial 10-55-10HZ, amplitude: 1.5mm, direction:
MIL-STD-202H
Method 201
Vibration Test
value L:within±5%
X, Y, Z axes, each axis 2 hours (total 6
hours).
2.no visible damage.
Reference
IR/convection reflow: Peak Temp 250±5℃
MIL-STD-202H
Method 210
Test Condition K
(Reflow)
Solder Heat
Resistance Test
for 30±5Sec. in air, Through 3 Cycle.
Temperature Ramp:+1~4°C/sec.; Above
183°C, must keep 90 s - 120 s.
1.no visible damage.
Solder temp: 245±5℃,
Immersion time: 5 second.
Immersion rate: 25±6mm/sec.
1. Lead must have 95%
above coverage.
J-STD-002D
Test condition B1
Solder Ability Test
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