65nm CMOS Standard Cell
CS200 ASIC Series
Server/
Network
HS-Tr
HS-Tr
D-
Low Power
Low Power
LLiinneeuupp
k
STDD--Tr
STD-Tr
CS200LL
CS200A
UHS-Tr
UHS-Tr
HV-Tr
D-
HV-Tr
HS-Tr
High End Server
Mo
C
High
High Performance
Performance
Lineup CS200HP
Mobile
Computing
STD-Tr
STD-Tr
Lineup CS200
Digital Consumer
LL-Tr
UHS: Ultra High Speed, HS: High Speed
STD: Standard, LL: Low Leakage
Cellular Phone
Fast
Speed
Features
• High integration
• Application specific IPs
– Transistor of 30–50nm gate length (ITRS road map 65nm)
– 12-layer fine pitch, copper wiring, and low-K insulating
material techniques
– Maximum 180 million gates, nearly twice that of 90nm
technology
– Computational cores: ARM7, 9, 11, Communication and
Digital-AV DSP
– Mixed signals: Wide range of ADCs and DACs
– HSIF logics: PCI-Express, XAUI, SATA, DDR, USB, HDMI
• High-speed interface SerDes macros (~10Gbps data rate)
• Wide range of PLLs: standard to high-speed 1.6GHz
• Standard I/Os: LVTTL, SSTL, HSTL, LVDS, P-CML
• Wide supply voltage (0.80V to 1.30V for core)
• Triple Vth Transistor options
• Various packages available (QFP, FBGA, EBGA, PBGA,
FC-BGA)
• Design methodology and support
– 50% reduction in SRAM cell size
– 30% increase in performance over 90nm
• Low power consumption/low leakage current
• I/O with pad structure with fine pad pitch technology for chip
size reduction
• High-speed library and low-power library available
– High speed: CS200HP
– Low leak: CS200L
– Methodology in place to support multi-million-gates
hierarchical designs
– Excellent design center support at Sunnyvale and Dallas
– Worldwide service organizations for global support
• Higher performance, gate propagation delay tpd = 4.4ps
(@1.2V, inverter, and F/O = 1, CS200HP)
• Compiled memory macros: 1T and 6T SRAMs, and ROM
Description
CS200 Series, 65nm standard cells CMOS process technology,
addresses the design challenges of the PDA and mobile computing
market in low power and multi-functionality. It also addresses
the need of ultra high performance design in leading-edge
networking, server computing, and in complex telecom
equipment applications. 65nm technology is available in 300mm
fabrication and supports high volume wafer capacity in multiple
manufacturing locations.