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CS200HP

更新时间: 2024-11-29 09:32:15
品牌 Logo 应用领域
富士通 - FUJITSU /
页数 文件大小 规格书
2页 505K
描述
65nm CMOS Standard Cell

CS200HP 数据手册

 浏览型号CS200HP的Datasheet PDF文件第2页 
65nm CMOS Standard Cell  
CS200 ASIC Series  
Server/  
Network  
r  
HS-Tr  
Low Power  
Lineup
k
STD-Tr  
CS200LL  
UHS-Tr  
HV-Tr  
HS-Tr  
High End Server  
High Performance  
Lineup CS200HP  
Mobile  
Computing  
STD-Tr  
Digital Consumer  
LL-Tr  
UHS: Ultra High Speed, HS: High Speed  
STD: Standard, LL: Low Leakage  
Cellular Phone  
Fast  
Speed  
Features  
• High integration  
• Application specific IPs  
Transistor of 30–50nm gate length (ITRS road map 65nm)  
– 12-layer fine pitch, copper wiring, and low-K insulating  
material techniques  
– Maximum 180 million gates, nearly twice that of 90nm  
technology  
– Computational cores: ARM7, 9, 11, Communication and  
Digital-AV DSP  
– Mixed signals: Wide range of ADCs and DACs  
– HSIF logics: PCI-Express, XAUI, SATA, DDR, USB, HDMI  
• High-speed interface SerDes macros (~10Gbps data rate)  
• Wide range of PLLs: standard to high-speed 1.6GHz  
• Standard I/Os: LVTTL, SSTL, HSTL, LVDS, P-CML  
• Wide supply voltage (0.80V to 1.30V for core)  
Triple Vth Transistor options  
• Various packages available (QFP, FBGA, EBGA, PBGA,  
FC-BGA)  
• Design methodology and support  
– 50% reduction in SRAM cell size  
– 30% increase in performance over 90nm  
• Low power consumption/low leakage current  
• I/O with pad structure with fine pad pitch technology for chip  
size reduction  
• High-speed library and low-power library available  
– High speed: CS200HP  
– Low leak: CS200L  
– Methodology in place to support multi-million-gates  
hierarchical designs  
– Excellent design center support at Sunnyvale and Dallas  
– Worldwide service organizations for global support  
• Higher performance, gate propagation delay tpd = 4.4ps  
(@1.2V, inverter, and F/O = 1, CS200HP)  
• Compiled memory macros: 1T and 6T SRAMs, and ROM  
Description  
CS200 Series, 65nm standard cells CMOS process technology,  
addresses the design challenges of the PDA and mobile computing  
market in low power and multi-functionality. It also addresses  
the need of ultra high performance design in leading-edge  
networking, server computing, and in complex telecom  
equipment applications. 65nm technology is available in 300mm  
fabrication and supports high volume wafer capacity in multiple  
manufacturing locations.  

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