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CRTD360P04L2-G PDF预览

CRTD360P04L2-G

更新时间: 2024-04-09 19:01:55
品牌 Logo 应用领域
华润微 - CRMICRO /
页数 文件大小 规格书
10页 799K
描述
TO-252(或DPAK)

CRTD360P04L2-G 数据手册

 浏览型号CRTD360P04L2-G的Datasheet PDF文件第2页浏览型号CRTD360P04L2-G的Datasheet PDF文件第3页浏览型号CRTD360P04L2-G的Datasheet PDF文件第4页浏览型号CRTD360P04L2-G的Datasheet PDF文件第5页浏览型号CRTD360P04L2-G的Datasheet PDF文件第6页浏览型号CRTD360P04L2-G的Datasheet PDF文件第7页 
Silicon P-Channel Power MOSFET  
CRTD360P04L2-G  
General Description  
VDSS  
-40  
-20  
27.7  
28  
V
A
CRTD360P04L2-G, the silicon P-channel Enhanced  
VDMOSFETs, is obtained by the high density Trench  
technology which reduce the conduction loss, improve switching  
performance and enhance the avalanche energy. This device is  
suitable for use as a load switch and PWM applications. The  
package form is TO-252, which accords with the RoHS standard.  
Features  
ID  
PD  
W
RDS(ON)Typ  
mΩ  
Fast Switching  
Low ON Resistance(Rdson≤36 m)  
Low Gate Charge  
Low Reverse transfer capacitances  
100% Single Pulse avalanche energy Test  
Applications:  
Power switch circuit of adaptor and charger.  
AbsoluteTj= 25unless otherwise specified)  
Parameter  
Symbol  
VDSS  
Rating  
Units  
Drain-to-Source Voltage  
-40  
V
A
Continuous Drain Current TC = 25 °C  
Continuous Drain Current TC = 100 °C  
Pulsed Drain Current TC = 25 °C  
Gate-to-Source Voltage  
-20  
ID  
-14.4  
A
a1  
-80  
A
IDM  
VGS  
±18  
46.2  
V
a2  
Avalanche Energy  
mJ  
W
EAS  
Power Dissipation TC = 25 °C  
Derating Factor above 25°C  
27.7  
PD  
0.22  
W/℃  
Operating Junction and Storage Temperature Range  
TJTstg  
15055 to 150  
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD. Page 1 of 10  
2019V01  

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