CRS04
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CRS04
Switching Mode Power Supply Applications
Unit: mm
Portable Equipment Battery Applications
•
•
•
•
Forward voltage: V
FM
= 0.49 V (max)
= 1 A
Average forward current: I
F(AV)
Repetitive peak reverse voltage: V
RRM
= 40 V
Suitable for compact assembly due to small surface-mount package
“S-FLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
V
40
V
A
RRM
I
1 (Note 1)
20 (50 Hz)
-55 to 150
-55 to 150
F (AV)
Non-repetitive peak forward surge current
Junction temperature
I
A
FSM
T
°C
°C
j
JEDEC
JEITA
―
―
Storage temperature
T
stg
Note 1: Ta = 31°C
TOSHIBA
3-2A1A
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm, land size: 6 mm × 6 mm)
Rectangular waveform (α = 180°), V = 20 V
Weight: 0.013 g (typ.)
R
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
V
V
V
V
I
I
I
= 0.1 A
= 0.7 A
= 1 A
―
―
―
―
―
―
0.395
0.475
0.51
0.6
―
0.49
―
FM(1)
FM(2)
FM(3)
FM
FM
FM
Peak forward voltage
I
V
V
V
= 5 V
―
RRM(1)
RRM(2)
RRM
RRM
Repetitive peak reverse current
Junction capacitance
μA
I
= 40 V
―
100
―
C
j
= 10 V, f = 1 MHz
47
pF
R
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 mm)
―
―
70
Thermal resistance (junction to ambient)
Thermal resistance (junction to lead)
R
th(j-a)
°C/W
°C/W
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 mm)
―
―
―
―
140
20
R
th(j-ℓ)
―
Start of commercial production
1999-07
1
2017-04-17