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CRM2512-FX-R330ELF PDF预览

CRM2512-FX-R330ELF

更新时间: 2024-01-21 21:43:44
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
3页 294K
描述
Thick fi lm technology

CRM2512-FX-R330ELF 数据手册

 浏览型号CRM2512-FX-R330ELF的Datasheet PDF文件第2页浏览型号CRM2512-FX-R330ELF的Datasheet PDF文件第3页 
Features  
Applications  
Power supplies  
Stepper motor drives  
Thick film technology  
Power rating of 2 watts at 70 °C  
RoHS compliant*  
CRM2512 - Pulse Resistant Power Resistor  
Electrical Characteristics  
Characteristic  
General Information  
®
The Bourns CRM2512 Series is a  
Model  
Model  
CRM2512  
thick- film power resistor with a rating of  
2 watts in a standard 2512 chip format.  
This product has a very wide resistance  
range making it suitable for different  
applications in power supply circuits  
including current sensing and inrush  
current limiting.  
CRM2512  
(0.110 to 0.91 Ω)  
(0 Ω, 1.0 Ω to 1.0 MΩ)  
Power Rating @ 70 °C  
Operating Temp. Range  
Derated to Zero Load at  
Maximum Working Voltage  
Maximum Overload Voltage  
Insulation Resistance  
2 W  
-55 °C to +155 °C  
+155 °C  
1349 mV  
2698 mV  
300 V  
600 V  
Characteristic Data  
> 1000 MΩ  
1 Ω - 9.1 Ω  
0 Ω,  
Test  
ΔR Max.  
0.110 - 0.91 Ω  
(E24 Values)  
10 Ω - 1 MΩ  
(E96 Values)  
1.0 - 1 MΩ  
(E24 Values)  
Resistance Range  
(E24 Values)  
Load Life (1000 hours)  
1 % Tolerance  
< 1 %  
< 3 %  
5 % Tolerance  
Resistance Tolerance  
Temperature Coefficient  
1 % ꢀ 5 %  
100 PPM/°C  
5 %  
200 PPM/°C  
1 %  
Short Term Overload  
100 PPM/°C  
1 % Tolerance  
< 1 %  
< 2 %  
Notes:  
5 % Tolerance  
2
(1) CRM2512 2 W loading with total solder pad and trace size of 300 mm .  
1/2  
Thermal Shock  
1 % Tolerance  
5 % Tolerance  
(2) E = (PxR)  
E: Working Voltage (V); P: Rated Power (W); R: Resistance Value (Ω)  
< 0.5 %  
< 1 %  
2
(3) Jumper (0 Ω): Rated current 6 A maximum with 300 mm pad.  
For Standard Values Used in Capacitors, Inductors, and Resistors, click here.  
Product Dimensions  
Soldering Profile  
6.3 ꢀ.ꢁꢀ  
(ꢀ.ꢁ48 ꢀ.ꢀꢀ8ꢂ  
250  
Peak 260 +5/-0 °C  
2ꢀ0 °C or higher  
3.1 ꢀ.ꢁꢀ  
(ꢀ.1ꢁꢁ ꢀ.ꢀꢀ8ꢂ  
TOP SIDE  
200  
150  
100  
Pre-heating Zone  
180 °C  
150 °C  
ꢀ.6 ꢀ.ꢁꢀ  
(ꢀ.ꢀꢁ4 ꢀ.ꢀꢀ8ꢂ  
ꢀ.6 ꢀ.ꢁꢀ  
(ꢀ.ꢀꢁ4 ꢀ.ꢀꢀ8ꢂ  
90 ꢀ0 ꢁeꢂonꢃꢁ  
ꢀ0 10 ꢁeꢂonꢃꢁ  
Solꢃering Zone  
1.8 ꢀ.ꢁꢀ  
50  
(ꢀ.ꢀ7ꢀ ꢀ.ꢀꢀ8ꢂ  
Heating Time  
Recommended Solder Pad Layout  
2.45  
(.096)  
Derating Curve  
100  
3.7  
(.146)  
7.6  
(.299)  
-55  
70  
155  
MM  
DIMENSIONS:  
Ambient Temperature (°C)  
(INCHES)  
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.  
Specifications are subject to change without notice.  
Users should verify actual device performance in their specific applications.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  

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