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CMS15(T2L,TEM,Q) PDF预览

CMS15(T2L,TEM,Q)

更新时间： 2024-11-18 21:22:07
品牌 Logo 应用领域
东芝 - TOSHIBA 测试光电二极管
页数 文件大小 规格书
5页 345K
描述
Rectifier Diode

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CMS15(T2L,TEM,Q) 技术参数

生命周期：Active包装说明：R-PDSO-F2
Reach Compliance Code：unknown风险等级：5.71
应用：GENERAL PURPOSE配置：SINGLE
二极管元件材料：SILICON二极管类型：RECTIFIER DIODE
最大正向电压 (VF)：0.58 VJESD-30 代码：R-PDSO-F2
最大非重复峰值正向电流：60 A元件数量：1
相数：1端子数量：2
最高工作温度：150 °C最低工作温度：-40 °C
最大输出电流：3 A封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
最大重复峰值反向电压：60 V最大反向电流：300 µA
反向测试电压：60 V表面贴装：YES
技术：SCHOTTKY端子形式：FLAT
端子位置：DUALBase Number Matches：1

CMS15(T2L,TEM,Q) 数据手册

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CMS15  
TOSHIBA Schottky Barrier Diode  
CMS15  
Radio-Frequency Rectification in Switching Regulators  
Unit: mm  
DC-DC Converters  
•
•
•
•
Repetitive peak reverse voltage  
Average forward current  
Peak forward voltage  
Suitable for high-density board assembly due to the use of a small  
Toshiba Nickname: M−FLATTM  
: V  
= 60 V  
= 3.0 A  
= 0.58 V (max)  
RRM  
: I  
F (AV)  
: V  
FM  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Symbol  
Rating  
Unit  
Repetitive peak reverse voltage  
Average forward current  
V
60  
V
A
RRM  
I
3.0 (Note 1)  
60 (50Hz)  
−40 to 150  
−40 to 150  
F (AV)  
Non-repetitive peak forward surge current  
Junction temperature  
I
A
FSM  
T
°C  
°C  
j
Storage temperature range  
T
JEDEC  
JEITA  
―
―
stg  
Note 1: Tℓ = 95°C  
Device mounted on a ceramic board  
Board size  
Soldering land size  
Board thickness  
: 50 mm × 50 mm  
: 2 mm × 2 mm  
: 0.64 mm  
TOSHIBA  
3-4E1S  
Weight: 0.023 g (typ.)  
Rectangular waveform : α = 180°, V = 30 V  
R
Note 2: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in temperature, etc.) may cause this product to  
decrease in the reliability significantly even if the operating conditions (i.e. operating  
temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
= 1.0 A (pulse test)  
Min  
Typ.  
Max  
Unit  
V
V
V
V
I
I
I
0.43  
0.49  
0.55  
1.0  
FM (1)  
FM (2)  
FM (3)  
FM  
FM  
FM  
Peak forward voltage  
= 2.0 A (pulse test)  
= 3.0 A (pulse test)  
0.58  
I
V
V
V
= 5 V (pulse test)  
= 60 V (pulse test)  
RRM (1)  
RRM (2)  
RRM  
RRM  
Repetitive peak reverse current  
Junction capacitance  
μA  
pF  
I
25  
300  
C
j
= 10 V, f = 1.0 MHz  
R
102  
Device mounted on a ceramic board  
board size : 50 mm × 50 mm  
soldering land size : 2 mm × 2 mm  
60  
board thickness : 0.64 mm  
Device mounted on a glass-epoxy board  
Thermal resistance  
(junction to ambient)  
board size  
: 50 mm × 50 mm  
R
135  
°C/W  
°C/W  
th (j-a)  
soldering land size : 6 mm × 6 mm  
board thickness : 1.6 mm  
Device mounted on a glass-epoxy board  
board size  
: 50 mm × 50 mm  
210  
16  
soldering land size : 2.1 mm × 1.4 mm  
board thickness : 1.6 mm  
Thermal resistance(junction to lead)  
R
th (j-ℓ)  
Start of commercial production  
2003-05  
1
2018-08-03  
12345

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