Features
ꢀ High resistance to heat and humidity
Applications
ꢀ Mobil phones
ꢀ Resistance to mechanical shock and
ꢀ Cellular phones
ꢀ CTV, VCR, HIC, FDD
pressure
220K
ꢀ Accurate dimensions for automatic
surface mounting
ꢀ Wide inductance range
(1.0nH to 1000uH)
CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors
General Specifications
Temperature Rise ........................................................................................................................................................................................20˚C max.
Ambient Temperature................................................................................................................................................................................. 80˚C max.
Operating Temperature......................................................................................................................................................................-20°C to +100°C
Storage Temperature........................................................................................................................................................................-40°C to +100°C
Resistance to Soldering Heat..........................................................................................................................................................260˚C, 5 seconds
Materials
Core Material
CM10, CM16.................................................................................................................................................................................Alumina Ceramic
CM20 ..............................................................................................................................................................................Polymer 3.9nH to 1000nH
CM25 .................................................................................................................................................................................Polymer 10nH to 180nH
CM32 .................................................................................................................................................................................Polymer 47nH to 180nH
Ferrite Core
CM25..............................................................................................................................................................................................220nH to 100uH
CM32 ..........................................................................................................................................................................................................220nH +
CM45 ....................................................................................................................................................................................................................All
Coil Type
CM10, CM16 ....................................................................................................................................................................................Copper plating
CM20, CM25, CM32, CM45 .................................................................................................................................................................Copper wire
Enclosure
CM10, CM16 ...................................................................................................................................................................................................Resin
CM20, CM25, CM32, CM45 ..................................................................................................................................................................Epoxy resin
Product Dimensions
CM100505, CM160808
CM201212
CM10:
CM10:
0.2 0.1
0.2 0.1
1.27 0.30
(.050 .012)
(.008 .004)
(.008 .004)
CM16:
CM16:
0.3 0.15
0.3 0.15
CM10:
CM16:
(.012 .006)
(.012 .006)
0.5 0.1
0.80 0.15
1.00 0.10
(. 039 .004)
(.020 .004) (.032 .006)
CM10:
CM16:
CM10:
1.27 0.20
(.050 .008)
MM
(INCHES)
0.5 0.1
0.80 0.15
1.0 0.1
DIMENSIONS ARE:
(.020 .004) (.032 .006)
(.040 .004)
CM16:
1.6 0.15
1.20
(.047)
(.063 .006)
2.0 + 0.30 - 0.20
(.079 + .012 - .008)
Marking
Marking
Marking
CM252016
CM322522
CM453232
3.2
(.125)
2.5
(.079)
2.0
(.079)
1.2
(.047)
1.2
(.047)
1.9
(.075)
4.5
(.177)
2.5
(.10)
3.2
(.126)
1.6
(.063)
2.2
(.086)
3.2 0.2
(.125 .008)
1.7 0.2
(.066 .008)
0.4
(.016)
0.6
(.024)
1.0
(.039)
1.0
(.039)
Recommended Land Pattern Dimensions
Model
a
b
c
CM10
CM16
CM20
CM25
CM32
CM45
0.5 to 0.6 (.019 to .023)
0.8 to 1.0 (.032 to .039)
1.0 to 1.2 (.039 to .047)
1.4 to 1.5 (.055 to .059)
1.6 to 2.0 (.063 to .079)
2.4 to 2.6 (.094 to .102)
1.5 to 1.7 (.059 to .067)
2.0 to 2.6 (.079 to .102)
3.0 to 3.8 (.118 to .150)
3.5 to 4.0 (.138 to .157)
4.0 to 4.6 (.157 to .181)
5.5 to 6.0 (.217 to .236)
0.5 to 0.6 (.019 to .023)
0.7 to 0.9 (.028 to .035)
0.9 to 1.3 (.028 to .051)
1.2 to 1.6 (.047 to .063)
1.9 to 2.4 (.075 to .094)
2.0 to 3.0 (.079 to .118)
c
a
b
Specifications are subject to change without notice.
5秒后页面跳转
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
技术参数
数据手册
如果您发现信息不准确，
