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CM160808-1N8DL PDF预览

CM160808-1N8DL

更新时间： 2025-07-27 17:40:51
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
3页 312K
描述
General Purpose Inductor, 0.0018uH, 16.667%, 1 Element, Alumina Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

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CM160808-1N8DL 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete包装说明：0603
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8504.50.80.00风险等级：5.82
Base Number Matches：1

CM160808-1N8DL 数据手册

 浏览型号CM160808-1N8DL的Datasheet PDF文件第2页浏览型号CM160808-1N8DL的Datasheet PDF文件第3页 
Features  
nꢀ Highꢀresistanceꢀtoꢀheatꢀandꢀhumidity  
nꢀ Resistanceꢀtoꢀmechanicalꢀshockꢀandꢀꢀ  
ꢀ
pressure  
nꢀ Accurateꢀdimensionsꢀforꢀautomaticꢀꢀ  
surfaceꢀmounting  
220K  
ꢀ
nꢀ Wideꢀinductanceꢀrangeꢀ(1.0ꢀnHꢀtoꢀ1000ꢀµH)ꢀ  
nꢀ RoHSꢀcompliant*  
ꢀꢀCM45ꢀSeriesꢀSMTꢀChipꢀInductors  
General Specifications  
Temperature Rise...................................................................................................................................................................... 20 ˚C max.  
Ambient Temperature .............................................................................................................................................................. 100 ˚C max.  
Operating Temperature....................................................................................................................................................-40 °C to +125 °C  
Storage Temperature.......................................................................................................................................................-40 °C to +125 °C  
Resistance to Soldering Heat.........................................................................................................................................260 ˚C, 5 seconds  
Materials  
Core Material............................................................................................................................................................................Ferrite Core  
Coil Type...................................................................................................................................................................................Copper wire  
Enclosure..................................................................................................................................................................................Epoxy resin  
Terminal...................................................................................................................................................................................................Sn  
Product Dimensions  
Recommended Land Pattern Dimensions  
Marking  
c
3.2ꢀ ꢀ0.2  
(.125ꢀ ꢀ.008)  
1.2  
(.047)  
a
b
4.5ꢀ ꢀ0.3  
(.177ꢀ ꢀ.012)  
3.2ꢀ±ꢀ0.2  
(.125ꢀ±ꢀ.008)  
a
b
c
2.0 to 2.4  
(.079 to .094)  
5.0 to 5.3  
(.197 to .209)  
1.4 to 1.7  
(.055 to .067)  
1.7ꢀ±ꢀ0.2  
(.066ꢀ±ꢀ.008)  
1.0  
(.039)  
1.0  
(.039)  
ꢀ
MM  
(INCHES)  
DIMENSIONS:  
ꢀ
Soldering Profile  
Temperature  
Rising Area  
Preheat Area  
Reflow Area  
Forced Cooling Area  
6 °C / sec. max.  
150~200 °C / 60~180 sec.  
250  
245  
Peak Temperature:  
250 °C max.  
20 ~ 40 sec.  
217  
200  
60 ~ 150 sec.  
Time at Peak  
150  
100  
50  
Temperature -5 °C:  
20~40 sec. max.  
Time Above 217 °C:  
60 ~ 150 sec. max.  
200 ~ 250 % Average  
Ramp-up Rate:  
3 °C / sec. max.  
50  
100  
150  
200  
250  
0
Time (Seconds)  
*RoHSꢀDirectiveꢀ2002/95/ECꢀJan.ꢀ27,ꢀ2003ꢀincludingꢀannexꢀandꢀRoHSꢀRecastꢀ2011/65/EUꢀJuneꢀ8,ꢀ2011.ꢀ  
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.  
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.  
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.  
123

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 		电感值:33 nH;电感公差:±5%;额定电流:300 mA;最小工作温度:-40°C;最

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