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CM160808-27NJL PDF预览

CM160808-27NJL

更新时间: 2024-11-14 17:40:51
品牌 Logo 应用领域
伯恩斯 - BOURNS 测试射频感应器电感器
页数 文件大小 规格书
3页 312K
描述
General Purpose Inductor, 0.027uH, 5%, 1 Element, Alumina Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

CM160808-27NJL 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:0603
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8504.50.80.00风险等级:5.78
大小写代码:0603构造:Chip
型芯材料:ALUMINA CERAMIC直流电阻:0.55 Ω
标称电感 (L):0.027 µH电感器应用:RF INDUCTOR
电感器类型:GENERAL PURPOSE INDUCTORJESD-609代码:e3
功能数量:1端子数量:2
最高工作温度:100 °C最低工作温度:-40 °C
封装高度:0.8 mm封装长度:1.6 mm
封装形式:SMT封装宽度:0.8 mm
包装方法:TR最小质量因数(标称电感时):10
最大额定电流:0.3 A自谐振频率:2000 MHz
系列:CM160808形状/尺寸说明:RECTANGULAR PACKAGE
屏蔽:NO表面贴装:YES
端子面层:Tin (Sn) - with Nickel (Ni) barrier端子位置:DUAL ENDED
端子形状:WRAPAROUND测试频率:100 MHz
容差:5%Base Number Matches:1

CM160808-27NJL 数据手册

 浏览型号CM160808-27NJL的Datasheet PDF文件第2页浏览型号CM160808-27NJL的Datasheet PDF文件第3页 
Features  
nꢀ Highꢀresistanceꢀtoꢀheatꢀandꢀhumidity  
nꢀ Resistanceꢀtoꢀmechanicalꢀshockꢀandꢀꢀ  
pressure  
nꢀ Accurateꢀdimensionsꢀforꢀautomaticꢀꢀ  
surfaceꢀmounting  
220K  
nꢀ Wideꢀinductanceꢀrangeꢀ(1.0ꢀnHꢀtoꢀ1000ꢀµH)ꢀ  
nꢀ RoHSꢀcompliant*  
ꢀꢀCM45ꢀSeriesꢀSMTꢀChipꢀInductors  
General Specifications  
Temperature Rise...................................................................................................................................................................... 20 ˚C max.  
Ambient Temperature .............................................................................................................................................................. 100 ˚C max.  
Operating Temperature....................................................................................................................................................-40 °C to +125 °C  
Storage Temperature.......................................................................................................................................................-40 °C to +125 °C  
Resistance to Soldering Heat.........................................................................................................................................260 ˚C, 5 seconds  
Materials  
Core Material............................................................................................................................................................................Ferrite Core  
Coil Type...................................................................................................................................................................................Copper wire  
Enclosure..................................................................................................................................................................................Epoxy resin  
Terminal...................................................................................................................................................................................................Sn  
Product Dimensions  
Recommended Land Pattern Dimensions  
Marking  
c
3.2ꢀ ꢀ0.2  
(.125ꢀ ꢀ.008)  
1.2  
(.047)  
a
b
4.5ꢀ ꢀ0.3  
(.177ꢀ ꢀ.012)  
3.2ꢀ±ꢀ0.2  
(.125ꢀ±ꢀ.008)  
a
b
c
2.0 to 2.4  
(.079 to .094)  
5.0 to 5.3  
(.197 to .209)  
1.4 to 1.7  
(.055 to .067)  
1.7ꢀ±ꢀ0.2  
(.066ꢀ±ꢀ.008)  
1.0  
(.039)  
1.0  
(.039)  
MM  
(INCHES)  
DIMENSIONS:  
Soldering Profile  
Temperature  
Rising Area  
Preheat Area  
Reflow Area  
Forced Cooling Area  
6 °C / sec. max.  
150~200 °C / 60~180 sec.  
250  
245  
Peak Temperature:  
250 °C max.  
20 ~ 40 sec.  
217  
200  
60 ~ 150 sec.  
Time at Peak  
150  
100  
50  
Temperature -5 °C:  
20~40 sec. max.  
Time Above 217 °C:  
60 ~ 150 sec. max.  
200 ~ 250 % Average  
Ramp-up Rate:  
3 °C / sec. max.  
50  
100  
150  
200  
250  
0
Time (Seconds)  
*RoHSꢀDirectiveꢀ2002/95/ECꢀJan.ꢀ27,ꢀ2003ꢀincludingꢀannexꢀandꢀRoHSꢀRecastꢀ2011/65/EUꢀJuneꢀ8,ꢀ2011.ꢀ  
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.  
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.  
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.  

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