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CM1206-04CP PDF预览

CM1206-04CP

更新时间： 2024-11-18 04:36:47
品牌 Logo 应用领域
CALMIRCO /
页数 文件大小 规格书
7页 222K
描述
ESD Protection Arrays, Chip Scale Package

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CM1206-04CP 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：CSP包装说明：R-PBGA-B6
针数：6Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：5.84配置：COMMON ANODE, 5 ELEMENTS
二极管元件材料：SILICON二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码：R-PBGA-B6JESD-609代码：e1
湿度敏感等级：1元件数量：5
端子数量：6封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：GRID ARRAY
峰值回流温度（摄氏度）：250极性：UNIDIRECTIONAL
认证状态：Not Qualified最大重复峰值反向电压：5.9 V
表面贴装：YES技术：AVALANCHE
端子面层：TIN SILVER COPPER端子形式：BALL
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

CM1206-04CP 数据手册

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CM1206  
ESD Protection Arrays, Chip Scale Package  
Product Description  
Features  
•
•
•
•
Functionally and pin compatible with CMD’s  
The CM1206 family of transient voltage suppressor  
arrays provides a very high level of protection for sensi-  
tive electronic components that may be subjected to  
ESD. The back-to-back Zener connections provide  
ESD protection in cases where nodes with AC signals  
are present.  
PACDN2404C/08C/16C family of devices  
OptiGuard™ coated for improved reliability at  
assembly  
4, 8, or 16 transient voltage suppressors in a single  
package  
In-system Electrostatic Discharge (ESD) protection  
to +18kV contact discharge per IEC 61000-4-2  
international standard  
These devices are designed and characterized to  
safely dissipate ESD strikes at levels well beyond the  
maximum requirements set forth in the IEC 61000-4-2  
international standard. All I/Os are rated at +18kV  
using the IEC 61000-4-2 contact discharge method.  
Using the MIL-STD-883D (Method 3015) specification  
for Human Body Model (HBM) ESD, all pins are pro-  
tected for contact discharges to greater than +30kV.  
•
•
Supports AC signal applications  
Compact Chip Scale Package (0.65mm pitch) for-  
mat saves board space and eases layout in space  
critical applications compared to discrete solutions  
and traditional wire bonded packages  
Lead-free versions available  
•
The Chip Scale Package format of these devices  
enable extremely small footprints that are necessary in  
portable electronics such as cellular phones, PDAs,  
internet appliances and PCs. The large solder bumps  
allow for standard attachment to laminate boards with-  
out the use of underfill.  
Applications  
•
•
ESD protection for sensitive electronic equipment  
I/O port, keypad and button circuitry protection for  
portable devices  
•
•
•
•
•
•
Wireless Handsets  
Handheld PCs / PDAs  
MP3 Players  
Digital Cameras and Camcorders  
Notebooks  
The CM1206 incorporates OptiGuard™ coating which  
results in improved reliability at assembly. The CM1206  
is also available with optional lead-free finishing.  
Desktop PCs  
Electrical Schematic  
B1  
B2  
B3  
D1 D2 D3  
D4 D5  
B1 B2  
B4 B5  
B3  
A3  
A1 A2  
A4 A5  
A1  
A2  
A3  
C1 C2 C3  
C4 C5  
B4 B5  
CM1206-04CS/CP  
CM1206-08CS/CP  
B1 B2  
B3  
A1 A2  
A3  
A4 A5  
CM1206-16CS/CP  
© 2004 California Micro Devices Corp. All rights reserved.  
06/28/04 430 N. McCarthy Blvd., Milpitas, CA 95035-5112  
●
Tel: 408.263.3214  
●
Fax: 408.263.7846  
●
www.calmicro.com  
1
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