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Datasheet > CLP-104-02-F-DH
CLP-104-02-F-DH PDF预览

CLP-104-02-F-DH

更新时间： 2024-11-18 22:57:23
品牌 Logo 应用领域
申泰 - SAMTEC PC连接器
页数 文件大小 规格书
1页 245K
描述
.050" X .050

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中文翻译

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CLP-104-02-F-DH 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：ROHS COMPLIANT
Reach Compliance Code：compliant风险等级：2.34
Samacsys Description：8 Position Low Profile Dual-Wipe Socket, 0.050 " Pitch, Surface Mount, Horizontal Dual-Row其他特性：LOW PROFILE, E.L.P.
主体宽度：0.135 inch主体深度：0.12 inch
主体长度：0.217 inch主体/外壳类型：SOCKET
连接器类型：BOARD CONNECTOR联系完成配合：GOLD FLASH OVER NICKEL (50)
联系完成终止：Tin (Sn) - with Nickel (Ni) barrier触点性别：FEMALE
触点材料：PHOSPHOR BRONZE触点模式：RECTANGULAR
触点电阻：10 m Ω触点样式：SQ PIN-SKT
DIN 符合性：NO耐用性：100 Cycles
滤波功能：NOIEC 符合性：NO
最大插入力：1.112 N绝缘体颜色：BLACK
绝缘体材料：LIQUID CRYSTAL POLYMER (LCP)JESD-609代码：e3
MIL 符合性：NO插接触点节距：0.05 inch
匹配触点行间距：0.05 inch插接信息：MULTIPLE MATING PARTS AVAILABLE
混合触点：NO安装方式：RIGHT ANGLE
安装类型：BOARD连接器数：ONE
PCB行数：2装载的行数：2
最高工作温度：125 °C最低工作温度：-65 °C
选件：GENERAL PURPOSEPCB接触模式：RECTANGULAR
PCB触点行间距：3.9878 mm电镀厚度：FLASH inch
额定电流（信号）：1.8 A参考标准：UL
可靠性：COMMERCIAL子类别：Headers and Edge Type Connectors
端子长度：端子节距：1.27 mm
端接类型：SURFACE MOUNT触点总数：8
撤离力-最小值：.556 N

CLP-104-02-F-DH 数据手册

  
LOW-PROFILE  
DUAL WIPE SOCKET  
(1.27 mm) .050" PITCH • CLP SERIES  
8
G
b p s  
CLP  
NO. PINS  
PER ROW  
PLATING  
OPTION  
ROW  
OTHER  
CLP  
1
02  
- -  
Mates:  
-
-
-
OPTION  
OPTIONS  
FTSH, FTS, FW  
02 thru 50  
–F  
–D  
= Double  
Row  
–BE  
= Gold flash  
on contact,  
Matte Tin  
on tail  
= Bottom Entry  
SPECIFICATIONS  
(Required for bottom  
entry applications)  
Insulator Material:  
Black Liquid Crystal Polymer  
Contact Material:  
Phosphor Bronze  
–DH  
= Double  
Horizontal  
(Requires  
FTSH–04  
lead style)  
–A  
–L  
= Alignment Pin  
Plating:  
= 10 µ"  
(0.25 µm)  
Gold on  
contact,  
Matte Tin  
on tail  
(Not available with –PA option)  
(05, 06, 07, 08, 10, 12, 15,  
20, 25, 30, 40 positions only)  
(–DH option and other sizes.  
Contact Samtec.)  
Sn or Au over  
50 µ" (1.27 µm) Ni  
Current Rating (CLP/FTSH):  
3.4 A per pin  
(2 pins powered)  
Voltage Rating:  
–K  
280 VAC/395 VDC  
Operating Temp Range:  
-55 °C to +125 °C  
Insertion Depth:  
Top Entry =  
–G  
= (4.00 mm) .157" DIA  
Polyimide film Pick & Place Pad  
(3 positions minimum)  
= 10 µ"  
(0.25 µm)  
Gold  
(–D only)  
–P  
(1.40 mm) .055" minimum  
Bottom Entry =  
= Pick & Place Pad  
(5 positions min. –D only)  
(Not always necessary  
for auto placement.  
See Flex Processing.)  
(2.41 mm) .095" minimum  
plus board thickness  
DH Entry =  
(2.31 mm) .091"to (2.67 mm) .105"  
Normal Force:  
–PA  
= Pick & Place Pad  
with Alignment Pin  
(–D only)  
60 grams (0.59 N) average  
Max Cycles:  
100 with 10 µ" (0.25 µm) Au  
(Not available with –A option)  
PROCESSING  
–TR  
No. of Positions x (1.27) .050 + (0.43) .017  
= Tape & Reel  
Lead-Free Solderable:  
Yes  
SMT Lead Coplanarity:  
(0.10 mm) .004" max (02-35)  
(0.15 mm) .006" max (36-50)*  
*(.004" stencil solution  
may be available; contact  
ipg@samtec.com)  
–FR  
(4.57)  
.180  
= Full Reel Tape & Reel  
(must order maximum  
quantity per reel;  
contact Samtec for  
quantity breaks)  
(4.32)  
.170  
ALSO AVAILABLE  
MOQ Required  
Single row  
Other platings  
(3.43)  
.135  
(2.29)  
.090  
—DH  
—D  
10 YEAR MFG  
WITH 30 µ" GOLD  
A
PIN/ROW  
A
EXTENDED LIFE  
PRODUCT  
04-15  
16-50  
(3.56) .140  
(7.11) .280  
HIGH MATING  
CYCLES  
—P OPTION  
—PA OPTION  
If odd pins/row, alignment pins are on  
middle position on centerline of the part.  
If even pins/row, then alignment pins are  
between middle two positions.  
Note:  
Some lengths, styles and  
options are non-standard,  
non-returnable.  
F-221 (Rev 28JUN21)  
samtec.com?CLP  
Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.  
1

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CLP-104-02-F-DH 替代型号

型号 品牌 替代类型 描述 数据表
CLP-104-02-F-DH-TR SAMTEC

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