Datasheet > CL10A475KQ8NNNC

CL10A475KQ8NNNC

更新时间： 2024-02-27 20:12:16

品牌	Logo	应用领域
三星 - SAMSUNG		/
页数	文件大小	规格书
2页	147K
描述
SPECIFICATION(Reference sheet)

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CL10A475KQ8NNNC 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	0603
包装说明：	, 0603	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8532.24.00.20
风险等级：	1.72	电容：	4.7 µF
电容器类型：	CERAMIC CAPACITOR	介电材料：	CERAMIC
JESD-609代码：	e3	安装特点：	SURFACE MOUNT
多层：	Yes	负容差：	10%
端子数量：	2	最高工作温度：	85 °C
最低工作温度：	-55 °C	封装形状：	RECTANGULAR PACKAGE
包装方法：	TR, CARDBOARD PAPER, 7 INCH	正容差：	10%
额定（直流）电压（URdc）：	6.3 V	尺寸代码：	0603
表面贴装：	YES	温度特性代码：	X5R
温度系数：	15% ppm/ °C	端子面层：	Tin (Sn) - with Nickel (Ni) barrier
端子形状：	WRAPAROUND	Base Number Matches：	1

CL10A475KQ8NNNC 数据手册

(Reference sheet)

SPECIFICATION

 Samsung P/N : CL10A475KQ8NNND

CAP, 4.7㎌, 6.3V, ±10%, X5R, 0603

 Supplier : Samsung electro-mechanics

 Product : Multi-layer Ceramic Capacitor

 Description :

A. Samsung Part Number

CL 10

475

①

②

③

④

⑤

⑥

⑦

⑧

⑨

⑩

⑪

① Series

② Size

Samsung Multi-layer Ceramic Capacitor

0.8

± 0.1 mm

0603 (inch code)

L: 1.6 ± 0.1

③ Dielectric

④ Capacitance

⑤ Capacitance

tolerance

X5R

⑧ Inner electrode

Termination

Plating

4.7

㎌

Sn 100%

Normal

±10 %

(Pb Free)

⑨ Product

⑩ Special

⑥ Rated Voltage

⑦ Thickness

6.3 V

Reserved for future use

Cardboard Type, 13" reel

0.8 ± 0.1 mm

⑪ Packaging

B. Samsung Reliability Test and Judgement condition

Performance

Test condition

Capacitance

Tan δ (DF)

Within specified tolerance

0.1 max.

1.0±0.2Vrms

1㎑±10%

Insulation

Rated Voltage

60~120 sec.

10,000Mohm or 100Mohm㎌

Whichever is Smaller

No abnormal exterior appearance

No dielectric breakdown or

mechanical breakdown

X5R

Resistance

Appearance

Withstanding

Voltage

Microscope (10)

250%

of the rated voltage

Temperature

Characteristics

Adhesive Strength

of Termination

Bending Strength

(From -55℃ to 85℃, Capacitance change should be within ±15%)

No peeling shall be occur on the

terminal electrode

500gF, for 10±1 sec.

Capacitance change :

within ±12.5% Bending to the limit (1mm)

with 1.0mm/sec.

Solderability

More than 75% of terminal surface

is to be soldered newly

SnAg3.0Cu0.5 solder

245±5℃, 3±0.3sec.

(preheating : 80~120℃ for 10~30sec.)

Resistance to

Soldering heat

Capacitance change :

within ±7.5%

Solder pot : 270±5℃, 10±1sec.

Tan δ, IR : initial spec.

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