Film Chip Capacitors
How to Order, Dimensions and Construction
HOW TO ORDER
CB
04
2
G
0104
K
--
Type
CB: SMD Lead Free
CL
Size
Dielectric
2 = PET-HT
8 = PPS
Voltage
B = 16V
C = 25V
D = 50/63V
E = 100V
G = 250V
I = 400V
Capacitance
1st digit: 0
Tolerance
EIA Code
G(1) = 2%
J = 5%
Suffix Packaging
-- = bulk
BA = tape & reel
diameter: 180mm
BC = tape & reel
diameter: 330mm
01: 1206
02: 1210
03: 1812
04: 2220
05: 2824
95: 2840
16: 4030
17: 5040
18: 6054
2nd & 3rd: the 2nd
significant figures of the
capacitance value.
4th digit: the number of
zeros to be added to the
capacitance value.
7 = PEN
K = 10%
K = 630V
Example of an order: How to order a chip film PET-HT 100nF 10% 250V bulk packaging.
(1): Tolerance G available only for PPS Series.
W
H
T
L
CASE DIMENSIONS: millimeters (inches)
Size Code
Equivalent size
1206
Length (L)
Width (W)
Termination Return
0.50 0.30 (0.020 0.012)
0.50 0.30 (0.020 0.012)
0.60 0.40 (0.024 0.157)
0.80 0.60 (0.032 0.024)
0.80 0.60 (0.032 0.024)
0.80 0.60 (0.032 0.024)
0.80 0.60 (0.032 0.024)
0.80 0.60 (0.032 0.024)
0.80 0.60 (0.032 0.024)
01
02
03
04
05
95
16
17
18
3.30 0.30 (0.130 0.012)
3.30 0.30 (0.130 0.012)
4.50 0.50 (0.177 0.020)
5.80 0.50 (0.228 0.020)
7.20 0.50 (0.283 0.020)
7.20 0.50 (0.283 0.020)
10.5 0.60 (0.413 0.024)
12.8 0.60 (0.504 0.024)
15.3 0.60 (0.602 0.024)
1.60 0.30 (0.063 0.012)
2.50 0.30 (0.098 0.012)
3.20 0.50 (0.126 0.020)
5.00 0.50 (0.197 0.020)
6.10 0.50 (0.240 0.020)
10.0 0.80 (0.343 0.031)
7.60 0.80 (0.299 0.031)
10.2 0.80 (0.401 0.031)
13.7 0.80 (0.539 0.031)
1210
1812
2220
2824
2840
4030
5040
6054
STACKED FILM CONSTRUCTION
Our SMD Film capacitors (CB series) are using stacked tech-
nology with metallized plastic film, which forms the basis for
the capacitive element. Combined with the nacked design
choice, it gives our products an again better self-healing
capability as well as a very good capacitance per volume
ratio. This also means that internal construction of the multi-
layer stack, usually hidden in encapsulated film capacitors
design, is visible at the cut edges in the surface mount con-
figuration. In a typical film capacitor stack, hundreds of film
layers are compacted during manufacture. Under a micro-
scope these have the appearance of pages in a book.
Subsequent manufacturing and pcb assembly processes
allow a small amount of relaxation in these layers. In some
cases, small gaps between layers may become visible. These
are referred to as microgaps, and their occurrence is a stan-
dard feature of this technology. Even if it can be considered
an cosmetic issue, presence of these gaps has no effect at all
on mechanical or electrical performance or reliability. (Detailed
report is available upon request.)
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