CHFP6KE75A

更新时间： 2024-11-14 22:50:31

品牌	Logo	应用领域
美高森美 - MICROSEMI		/
页数	文件大小	规格书
3页	158K
描述
Patented Flip-Chip Series

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中文翻译

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数据手册

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CHFP6KE75A 数据手册

FLIP-CHIP TVS DIODES

8700 E. Thomas Road

Scottsdale, AZ 85251

Tel: (480) 941-6300

Fax: (480) 947-1503

CHFP6KE5.0

thru

CHFP6KE170CA

Patented Flip-Chip Series

FEATURES

Unidirectional and Bidirectional

Fully glass passivated

600 watt (10/1000 ms)

Eliminates wire bonding

NON Inductive Insertion

No voltage overshoot

MAXIMUM RATINGS

Max Junction Temperature: 150⁰C (with conformal coating)

Storage Temperature: -55⁰C to +150⁰C

Flip-Chip Peak Pulse Power: 600 Watts (10/1000 ms)

Maximum non-repetitive peak power 600 Watts (10/1000 ms)

Total continuous power dissipation 2.5 W (with adequate heat

sink @ 75⁰C)

MECHANICAL

Weight: 0.01 grams (approximate)

Solderable standoff tabs .040X.040X.010

Turn-on time (theoretical) unidirectional 1X10^-12

Turn-on time (theoretical) bidirectional 1X10^-9

PACKAGING

Waffle package 50 pices or wafer ring 70 pieces

BIDIRECTIONAL ALL DIMENSIONS NOMINAL

inches (mm)

FLIP-CHIP DIMENSIONS

PAD SIZE & CIRCUIT

UNIDIRECTIONAL ALL DIMENSIONS NOMINAL

inches (mm)

FLIP-CHIP DIMENSIONS

PAD SIZE & CIRCUIT

V_BRabove 30 V

V_BR30V and below

MSC1596.PDF

ISO 9001 CERTIFIED

REV B 3/13/2000

12 3

中文翻译

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