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CHFP6KE15 PDF预览

CHFP6KE15

更新时间: 2024-02-29 08:04:21
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
3页 158K
描述
Patented Flip-Chip Series

CHFP6KE15 数据手册

 浏览型号CHFP6KE15的Datasheet PDF文件第2页浏览型号CHFP6KE15的Datasheet PDF文件第3页 
FLIP-CHIP TVS DIODES  
8700 E. Thomas Road  
Scottsdale, AZ 85251  
Tel: (480) 941-6300  
Fax: (480) 947-1503  
CHFP6KE5.0  
thru  
CHFP6KE170CA  
Patented Flip-Chip Series  
FEATURES  
·
·
·
·
·
·
Unidirectional and Bidirectional  
Fully glass passivated  
600 watt (10/1000 ms)  
Eliminates wire bonding  
NON Inductive Insertion  
No voltage overshoot  
MAXIMUM RATINGS  
·
·
·
·
·
Max Junction Temperature: 1500C (with conformal coating)  
Storage Temperature: -550C to +1500C  
Flip-Chip Peak Pulse Power: 600 Watts (10/1000 ms)  
Maximum non-repetitive peak power 600 Watts (10/1000 ms)  
Total continuous power dissipation 2.5 W (with adequate heat  
sink @ 750C)  
MECHANICAL  
·
·
Weight: 0.01 grams (approximate)  
Solderable standoff tabs .040X.040X.010  
·
·
Turn-on time (theoretical) unidirectional 1X10-12  
Turn-on time (theoretical) bidirectional 1X10-9  
PACKAGING  
·
Waffle package 50 pices or wafer ring 70 pieces  
BIDIRECTIONAL ALL DIMENSIONS NOMINAL  
inches (mm)  
FLIP-CHIP DIMENSIONS  
PAD SIZE & CIRCUIT  
UNIDIRECTIONAL ALL DIMENSIONS NOMINAL  
inches (mm)  
FLIP-CHIP DIMENSIONS  
PAD SIZE & CIRCUIT  
VBR above 30 V  
VBR 30V and below  
MSC1596.PDF  
ISO 9001 CERTIFIED  
REV B 3/13/2000  

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