Datasheet > CHF8838CNF_08

CHF8838CNF_08

更新时间： 2024-02-07 12:16:44

品牌	Logo	应用领域
伯恩斯 - BOURNS		/
页数	文件大小	规格书
1页	185K
描述
150 W Power RF Flanged Chip Termination

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中文翻译

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CHF8838CNF_08 数据手册

Features

Applications

■ High power RF transmission

■ DC to 3.0 GHz

■ Flanged model

■ Low VSWR

■ Aluminium Nitride ceramic

CHF8838xNF Series 150 W Power RF Flanged Chip Termination

General Specifications

Characteristic Curve

Substrate...........................................ALN

Resistive Film...........................Thick Film

Tab.......................................................Ag

Tab Attachment

Version C .................Brazed with epoxy

encapsulation

Version G.....Brazed with alumina cover

Mounting Flange ..........Cu plated with Ni

Resistance........................................50 Ω

Tolerance......................................... 5 ꢀ

Packaging.............................60 pcs./tray

160

140

120

100

Absolute Ratings

Power.............................................150 W

Frequency ...................................3.0 GHz

VSWR

-55

100

150

Heat Sink Temperature (°C)

Version C .........................1.2 maximum

Version G .........................1.1 maximum

Product Dimensions

22.1

(0.870)

14.22

(0.560)

VERSION C:

2.77

(0.1089)

6.35

(0.25)

1.57

(0.062)

VERSION G:

3.10

(0.122)

9.53

(0.375)

VERSION C:

3.5

(0.14)

DIA.

6.5

(0.256)

MILLIMETERS

DIMENSIONS =

VERSION G:

4.3

(INCHES)

DIA.

(0.17)

1.5

(0.059)

0.1

(0.004)

2.57

(0.101)

How To Order

CHF 8838 C N F 500 L

Model

Size

Asia-Pacific:

Version (See Product Dimensions)

C = Without Alumina Cover

G = With Alumina Cover

Tel: +886-2 2562-4117

Fax: +886-2 2562-4116

Europe:

Tel: +41-41 768 5555

Fax: +41-41 768 5510

The Americas:

Tel: +1-951 781-5500

Fax: +1-951 781-5700

www.bourns.com

Substrate

Mount

F = Flange

Value

500 = 50 Ohms

Function

L = Termination

*RoHS Directive 2002/95/EC Jan 27 2003, including Annex

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

REV. 09/08

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